MEMS Modeling and Design


Three-Dimensional Transient Electro-Thermal Interconnect Simulation for Stress and Electromigration Analysis

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We introduce the combination of three-dimensional transient electro-thermal interconnect simulations for intrinsic thermo-mechanical stress problems. In order to study the development of thermal stresses we use a finite element simulator for the investigation on stresses [...]

Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 8, 2005
Industry sector: Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 0-9767985-2-2