Büttgenbach S. – TechConnect Briefs

Gentle Micropump based on Microelectromagnetic Actuator

Al-Halhouli A.T., Waldschik A., Kilani M.I., Büttgenbach S., Technische Universität Braunschweig, DE

This work presents the fabrication and development of a new multifunction micropump based on integrated electromagnetic microactuator. The novel design consists of a fluidic chip, two microfabricated polymer magnets and chip cover. These components form [...]

Micro-Fabricated Electrostatic Voltage Sensor with a Thin Bulk-Silicon Device Layer

Dittmer J., Judaschke R., Büttgenbach S., Technische Universität Braunschweig, DE

Micro-fabricated sensors made of a 20 µm thick bulk-silicon device layer for electrostatic voltage measurements are presented. A rotational, seesaw-like actuator with two electrically isolated electrodes on its ends forming parallel-plate capacitors with opposing electrodes [...]

Contactless Micro Position and Angular Sensor Device Based on Micro Structured Polymer Magnets

Waldschik A., Feldmann M., Dittmer J., Büttgenbach S., Technische Universität Braunschweig, DE

In this abstract we present a contactless micro position and angular sensor system which consists of fixed commercial magnetic sensors, such as hall sensors and a movable part with integrated micro structured polymer magnets. This [...]

Pneumatically driven Auxiliary Micro Tools for Desktop Factories

Hoxhold B., Büttgenbach S., Technische Universität Braunschweig, DE

This paper presents the design and the fabrication process of two novel pneumatically driven auxiliary micro tools that can be used to improve and to speed up assembling processes in desktop factories. The described micro [...]

Design for Manufacturing integrated with EDA Tools

Triltsch U., Büttgenbach S., Technical University of Braunschweig, DE

In this paper we present a process planning and optimization tool which can be linked to commercially available EDA tools. The increasing variety of available fabrication technologies and materials for microtechnological devices make the design [...]

Modeling and Design of Electrostatic Voltage Sensors Based on Micromachined Torsional Actuators

Dittmer A., Dittmer J., Dittmer A., Dittmer J., Judaschke R., Büttgenbach S., Technische Universität Braunschweig, DE

The optimization of design parameters and methods for electrostatic voltage sensors based on torsional actuators is presented. The analytical software model used for this optimization process is discussed and compared to measurement results. Voltage excitation [...]

Novel synchronous linear and rotatory micro motors based on polymer magnets with organic and inorganic insulation layers

Feldmann M., Waldschik A., Büttgenbach S., Institut for Microtechnology (IMT), DE

Electromagnetic micro actuators have reached a growing interest in micro technology in addition to commercial applications during the last years. Their basic construction exists of electric conductors and coil systems as well as of soft-magnetic [...]

Novel Electro Magnetic Micro Pump

Feldmann M., Demming S., Büttgenbach S., Institute for Microtechnology, DE

The mergence of partial aspects and functional components of micro actuators and micro fluidic technology allows the development of complex micro systems. This enormous potential is shown in this article by the realization of an [...]

Optimization of Masks for High Aspect Ration UV-Lithographic Patterning

Triltsch U., Büttgenbach S., Technische Universität Braunschweig, DE

The increasing complexity of micro actuators and micro sensors (e.g. electroplated micro coils, flux guidances, insulation and planarization layers) make new fabrication technologies and materials inevitable. For such purposes thick-film photo resists like SU-8 or [...]

Piezoresistive effect in DLC Films and Silicon

Tibrewala A., Phataralaoha A., Peiner E., Bandorf R., Büttgenbach S., TU Braunschweig, DE

In this work piezoresistive effect in Diamond-like carbon (DLC) films and p-diffused strain gauges is compared for the first time. DLC films are already well known in optical coatings. Here it is integrated with silicon [...]