TechConnect Briefs is an open access journal featuring more than 10,000 applications-focused research papers presented at the TechConnect World Innovation Conference and the Nanotech conferences over the last 20 years.
In alignment with the goals of the TechConnect World Innovation Conference, TechConnect Briefs papers provide sufficient background and key results to enable researchers and innovators from across a broad range of research fields and industry sectors to quickly assess the new materials and technologies that are presented. Further details, beyond the scope of the 4-page Briefs papers, may be obtained from the authors during or after their conference presentations, or from their published papers in the plethora of more focused field-specific journals.
Please browse and search this unique journal with an open mind. Over the last 20 years we have seen many examples of new products and innovations that have arisen from the connections made between researchers from different locations and different fields. You may be surprised where you find the new material or device or collaborator you are seeking!
TechConnect Briefs includes papers on the following topics:
- Advanced Materials
- Advanced Manufacturing
- Energy and Sustainability
- Electronics & Microsystems
- Biotech & Medical
- Personal & Home Care, Cosmetics, Food, Agriculture
As an Open Access journal, all papers published in the TechConnect Briefs journal are free to access online as soon as they are published, anyone can read and cite the paper. There is no publishing charge for papers, but one of the authors must register for the TechConnect World Innovation Conference or annual Nanotech conference and present the paper as either an oral presentation or a poster at that event.
TechConnect and associated reviewers and scientific committees, make every effort to ensure the accuracy of all the information (the “Content”) contained in our publications. However, TechConnect, our agents, and our licensors make no representations or warranties whatsoever as to the accuracy, completeness, or suitability for any purpose of the Content. Any opinions and views expressed in this publication are the opinions and views of the authors, and are not the views of or endorsed by TechConnect. The accuracy of the Content should not be relied upon and should be independently verified with primary sources of information. TechConnect shall not be liable for any losses, actions, claims, proceedings, demands, costs, expenses, damages, and other liabilities whatsoever or howsoever caused arising directly or indirectly in connection with, in relation to, or arising out of the use of the Content.