US – Page 456 – TechConnect Briefs

Efficient Poisson Equation Solvers for Large Scale 3D Simulations

Speyer G., Vasileska D., Goodnick S.M., Arizona State University, US

Self-consistent semiconductor device modeling requires repeated solution of the 2D or 3D Poisson equation that describes the potential profile of the device for a given charge distribution. As a result, efficient methods for the solution [...]

Fast Fluid Analysis for Multibody Micromachined Devices

Wang X., Mucha P., White J.K., Massachusetts Institute of Technology, US

Recently developed fast integral equation methods for computing solutions to the Stokes' equation have proven to be a valuable tool for micro-machined device designers. The speed of these fast codes make it possible to simulate [...]

Modeling of Ionic Hydrogel Kinetics in Buffered Solutions

Ohs R.R., De S.K., Aluru N.R., University of Illinois at Urbana-Champaign, US

In this paper, we present the meshless Finite Cloud Method (FCM) for the solution of a time-dependent partial differential equation governing ionic gel swelling. Using a point distribution, FCM constructs interpolation functions without assuming any [...]

Multiscale Modeling of Microfluidics

Karniadakis G., Brown University, US

Micro-electro-mechanical systems involve complex functions governed by diverse transient physical and electrical processes for each of their many components. This is an example of a coupled-domain simulation, i.e., the simultaneous simulation of different functional units [...]

Analysis of Realistic Large MEMS Devices

Ljung P., Bächtold M., Spasojevic M., Coyote Systems, Inc., US

A high-speed high-accuracy 3D field solver for the solution of coupled multi-physics encountered in MEMS is presented. The software AutoMEMS enables automatic model generation from layout, automatic meshing, adaptive mesh refinement of large complex geometries [...]

A Computational Framework for Modeling One-Dimensional, Sub-Grid Components and Phenomena in Multi-Dimensional Micro-Systems

Pindera M.Z., Bayyuk S., Upadhya V., Przekwas A.J., CFD Research Corporation, US

This paper presents a framework for modeling essentially one-dimensional devices and components embedded in multi-dimensional spaces. The main characteristic and main advantage of the new methodology is that the one-dimensional and multi-dimensional objects or domains [...]

Modified Nodal Analysis for MEMS with Multi-Energy Domains

Clark J.V., Zhou N., Pister K.S.J., University of California at Berkeley, US

A modified nodal analysis approach for the design, simulation, and display of three-dimensional microelectro-mechanical systems with coupled energy domains is presented. Static, steady-state, and transient algorithms are introduced followed by examples. Transient and static analysis [...]

Numerical Simulation of Micro Assembly Techniques in MEMS Devices

Finch N., Keating D., He Y., IntelliSense Corporation, US

This paper presents research on numerical simulation of the micro-assembly of MEMS devices. Recent developments in MEMS devices ñ making use of multiple deposition layers, micro-fabricated hinges, and actuators ñ have enabled fabrication of MEMS [...]

GEODESIC: A New and Extensible Geometry Tool and Framework with Application to MEMS

Wilson N., Wang K., Yergeau D., Dutton R.W., Stanford University, US

This paper will detail the capabilities of a new geometric modeling tool, called Geodesic, which is being released in source code form to the general community. In addition to providing geometric operations to create geometry [...]

CFD-Micromesh: A Fast Geometrical Modeling and Mesh Generation Tool for 3D Microsystem Simulations

Tan Z., Furmanczyk M., Turowski M., Przekwas A.J., CFD Research Corporation, US

In this work, a new fully automated geometrical modeling and meshing tool is described. It imports standard layout formats (CIF, GDSII, DXF), images (GIF, JPG), and 3D boundary representations (STL). A 3D model is then [...]