Improved Electric Field Decomposition Capacitance Model with 3-D Terminal and Fringe Components in Sub-28nm Interconnect

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In this paper, a parasitic capacitance model for a finite single three-dimensional (3-D) wire above an infinite plate in the nano-scale 3-D integrated circuit application is developed based on electric field decomposition (EFD). The capacitance [...]

Surface Potential Based Compact I-V Model for GaN HEMT Devices

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Gallium Nitride (GaN)-based high electron mobility transistors (HEMTs) are emerging as promising contenders to replace existing Silicon and Gallium Arsenide (GaAs) devices in the radio-frequency/microwave power amplifiers and high-power switching applications. Along with the fast [...]