This paper presents a framework for modeling essentially one-dimensional devices and components embedded in multi-dimensional spaces. The main characteristic and main advantage of the new methodology is that the one-dimensional and multi-dimensional objects or domains are meshed completely independently of each other, without regard to their relative alignment or location, and subsequently combined into a single, unified composite mesh. The coupling of the solution between the different domains is handled fully-automatically in the solver, entirely through exchange of source terms between these domains of differing dimensionality. The source terms are evaluated locally on a cell-by-cell basis, depending on the solution values in these domains and the manner in which the one-dimensional grids intersect the multi-dimensional grids. The capabilities and usefulness of the method are demonstrated with several examples.
Journal: TechConnect Briefs
Volume: Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems
Published: March 27, 2000
Pages: 727 - 730
Industry sector: Sensors, MEMS, Electronics
Topics: Modeling & Simulation of Microsystems