Turowski M. – TechConnect Briefs

Coupled Multiphysics Modeling of Semiconductor Lasers

Sikorski Z., Jiang Y., Czyszanowski T., Przekwas A., Turowski M., CFD Research Corporation, US

Comprehensive models of semiconductor lasers are required to predict realistic behavior of various laser devices for the spatially nonuniform gain that results due to current crowding. Nonuniform gain has visible effect on laser dynamics and [...]

Efficient Full-Wave Modeling of Electromagnetic Field Propagation Through Micro-Optical Link

Sikorski Z., Turowski M., Przekwas A.J., CFD Research Corporation, US

Low dimensions of contemporary micro-optics imply the necessity of inclusion of vector diffraction effects into optical models. Classical geometrical optics and Gaussian beam calculation approaches are too coarse approximations. They do not properly take into [...]

Modeling of Electromagnetic Fields in High Speed Electronic Interconnects Using a Least Squares FD-TD Algorithm

Tramel R.W., Turowski M., Przekwas A.J., Schultz J., Frey R.G., CFD Research Corporation, US

A new Finite-Surface Time-Domain (FS-TD) numerical method is presented which is a generalization of the classical Finite-Difference Time-Domain (FD-TD) method of Yee. The method is divergence/charge preserving on arbitrary grids. It reverts to the standard [...]

Coupled System-Level and Physical-Level Simulation

Furmanczyk M., Turowski M., Yu E., Przekwas A.J., CFD Research Corporation, US

Software tools for Mixed-Level Coupled Simulations have been developed. The system-level simulation uses the circuit theory approach, where each element of the system is modeled either through mathematical equation, or through coupling with physical-level 3D [...]

Coupled Electrostatic-Structures-Fluidic Analysis of a Micromirror

Turowski M., Chan E., Dionne P., CFD Research Corporation, US

For micromirrors used in optical MEMS, in addition to the static displacement-voltage characteristics, the accurate transient characterization of these devices is becoming increasingly important. The latter one is strongly affected by the viscous damping

CFD-Micromesh: A Fast Geometrical Modeling and Mesh Generation Tool for 3D Microsystem Simulations

Tan Z., Furmanczyk M., Turowski M., Przekwas A.J., CFD Research Corporation, US

In this work, a new fully automated geometrical modeling and meshing tool is described. It imports standard layout formats (CIF, GDSII, DXF), images (GIF, JPG), and 3D boundary representations (STL). A 3D model is then [...]

High-Fidelity and Reduced Models of Synthetic Microjets

Przekwas A.J., Turowski M., Chen Z., CFD Research Corporation, US

Microfabricated arrays of synthetic jets are being explored for applications in aerodynamic flow control, in cooling of electronic packages, and in mixing in microchemical reactors. Computational simulation of coupled unsteady fluid mechanics and electromechanical actuation [...]

High-Fidelity and Behavioral Simulation of Air Damping in MEMS

Turowski M., Chen Z., Prezekwas A., CFD Research Corporation, US

The paper presents simulations of air damping in MEMS, including squeeze-film and viscous dissipation, using different level models: 3D numerical solution of Navier-Stokes equations (using CFD-ACE from CFDRC), and circuit/behavioral model (in SPICE and Saber/MAST [...]