IntelliSense Corporation – TechConnect Briefs

Full Wave Electromagnetic Analysis and Model Order Reduction for Complex Three Dimensional Structures

Balk I., He Y., IntelliSense Corporation, US

Progress in MEMS and packaging design has made significant changes in the requirements for modeling tools. In order to design a modern microdevice or interconnect system it is no longer sufficient to limit the analysis [...]

Numerical Simulation of Micro Assembly Techniques in MEMS Devices

Finch N., He Y., Keating D., IntelliSense Corporation, US

This paper presents research on numerical simulation of the micro-assembly of MEMS devices. Recent developments in MEMS devices ñ making use of multiple deposition layers, micro-fabricated hinges, and actuators ñ have enabled fabrication of MEMS [...]

Stability Criterion for Microscale Concentric Flow of Two Immiscible Liquids

Gallegos C., Ho L.W., Marchetti J., IntelliSense Corporation, US

This paper addresses the establishment of a stability criterion for isothermal laminar concentric flow of two immiscible liquids. Using the approach of combined non-dimensional group anlysis and numerical simulations, it is established that the inner [...]