Numerical Simulation of Micro Assembly Techniques in MEMS Devices

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This paper presents research on numerical simulation of the micro-assembly of MEMS devices. Recent developments in MEMS devices ñ making use of multiple deposition layers, micro-fabricated hinges, and actuators ñ have enabled fabrication of MEMS devices that can deform out of plane. Applications include latching mechanisms and tilting mirrors. The simulation methodology has been developed which allows a MEMS designer to take into account the required actuation forces, interfacing mechanisms, and time constraints for micro-assembly. The simulation results rely on multi-stage contact analysis, dynamic analysis, and large displacement theory. Results will be presented for two case examples.

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Journal: TechConnect Briefs
Volume: Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems
Published: March 27, 2000
Pages: 720 - 722
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9666135-7-0