Improved Electric Field Decomposition Capacitance Model with 3-D Terminal and Fringe Components in Sub-28nm Interconnect
He J., He X., He Y., Hu G., Li C., Liu J., Ma G., Pan J., Zhang A., Peking University Shenzhen Institute and PKU-HKUST Shenzhen-Hong Kong Institution, CN
In this paper, a parasitic capacitance model for a finite single three-dimensional (3-D) wire above an infinite plate in the nano-scale 3-D integrated circuit application is developed based on electric field decomposition (EFD). The capacitance [...]