CarrICool – the Innovative 3D Interposer Platform for HPC Systems: Analysis, Simulations, Optimization, Practice for Reliability Improvement and Performance Increase

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This paper presents specific solutions being developed in frame of the CarrICool (abbr. “Modular Interposer System Architecture providing scalable Heat Removal, Power Delivery and Optical Signaling”) European FP7 project. The presented research and developed solutions [...]

Three-Dimensional Transient Electro-Thermal Interconnect Simulation for Stress and Electromigration Analysis

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We introduce the combination of three-dimensional transient electro-thermal interconnect simulations for intrinsic thermo-mechanical stress problems. In order to study the development of thermal stresses we use a finite element simulator for the investigation on stresses [...]