Compact Modeling of Signal Transients and Integrity Analysis for Dispersionless Interconnect


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In this paper, a compact model for transient response of the dispersionless interconnects is rigorously derived with resistive, inductive and capacitive load terminations. The proposed compact models are verified by the HSPICE simulation result to be highly accurate. And the analysis of signal integrity such as delay and noise for the dispersionless interconnect is also demonstrated by the mans of the developed compact model.

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Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 13, 2011
Pages: 686 - 689
Industry sector: Advanced Materials & Manufacturing
Topics: Informatics, Modeling & Simulation
ISBN: 978-1-4398-7139-3