, Bindel, D.
, Clark, J.
, Demmel, J.
, Pister, K.
, Zhou, N.
, University of California Davis, US
SUGAR is a modified nodal analysis package for 3D MEMS simulations that owes its heritage and its name to the SPICE family of circuit simulation. SUGAR has undergone the stage of proof-of-concept which showed that [...]
A methodology to improve the performance of iterative solvers in 3-D stress analysis using scalar algebraic multigrid (AMG) solvers has been presented. The principle idea is to split the global system of coupled stress governing [...]
The nonlinear Poisson-Boltzmann (PB) eequation is solved using Pseudo Transient Continuation. The PB solver is constructed by modifying the nonlinear diffusion modeule of a 3D, massively parallel, unstructured grid, finite element, radiation-hydrodynamics code. The solver [...]
A simple, empirically-based method is developed for extraction of submicron surface-channel MOSFET’s effective channel length (Leff) with critical-dimension correction to poly-gate length (Lg) and correlation to metallurgical channel length (Lmet). A self-consistent compact model for [...]
This paper presents and validates compact, physically-based electrothermal models of the avalanche process in pn junctions for use in network simulators (e.g. Saber). Self-heating effects are also included. This enables the simulation of large systems [...]
The exploration and modeling of high-frequency MOSFET phenomena are vitally important because MOSFETs are emerging as candidates for active devices in front-end RF circuits operating at more than 1GHz [1-2]. In this work we present [...]
, Gattel, F.
, Larcher, L.
, Marmiroli, A.
, Pavan, P.
, Università di Modena e Reggio Emilia, IT
This paper presents a new compact model of Floating Gate Non-Volatile Memory Cells using SPICE circuit elements. It features many advantages compared to previous models: it is simple and easy to implement and to update, [...]
, Liu, X.
, Qian, C.
, Sheng, Z.
, Sun, Z.
, Nanyang Technological University, SG
A novel general design method, which is based on S-parameters and suitable for MMIC and MEMS, has been developed for antiphase balanced oscillators in this paper. To demostrate the design method, a new type of [...]
Progress in MEMS and packaging design has made significant changes in the requirements for modeling tools. In order to design a modern microdevice or interconnect system it is no longer sufficient to limit the analysis [...]
In this paper, we present a table-based numerical macromodeling method in which a MEMS device is modeled by a set of numerical ordinary differential equations and model functions are represented by look-up tables of numerical [...]
A fully automatic macromodeling methodology to generate scalable reduced-order models for microelectromechanical systems is presented in this paper. Krylov subspace methods are used to generate reduced-order models from detailed higher-order models of the device under [...]
A numerical model for the squeezed-film damping between moving rigid, rectangular surfaces is presented. The emphasis is on the nontrivial boundary conditions for the flow, accounting for the finite acoustic impedance of the surrounding gas [...]
This paper reports a design concept for robustness improvement of micromachined gyroscopes. The novelty of the approach is in expanding the design space of the device by increasing the degrees-of-freedom (DOF) of the system. The [...]
A compact thermal model is presented, which describes the hot spot (junction) temperatures and contact heat flows of electronic packages or systems in the stationary state. The model is exact provided that the underlying heat [...]
Temperature sensitive curling is commonly observed in MEMS structures fabricated using a standard CMOS pro-cess. In this paper, a macromodel for vertical and lateral curling effects is derived by extending thermal multimorph theory for cantilever [...]
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems
Published: March 19, 2001
Industry sector: Sensors, MEMS, Electronics
Topics: Compact Modeling