Papers – Page 20 – TechConnect Briefs

Mixed-Level Model for Highly Perforated Torsional Actuators Coupling the Mechanical, the Electrostatic and the Fluidic Domain

Sattler R., Schrag G., Wachutka G., Institute for Physics of Electrotechnology, DE

Electrostatic attraction between neighboring electrodes is a widely used actuation principle employed in tiltable micromirrors or microrelays. Electrostatic actuation is especially favored for switching applications in mobile telecommunication because of its low power consumption. State-of-the-art [...]

Magnetic Diffusion in Nonlinear Micro-Media: A Modified Finite-Difference Time-Domain Approach

Cros F., Allen M.G., Lang J.H., Massachusetts Institute of Technology, US

As flux densities and frequencies are raised to increase the performance of magnetic micro-actuators, micro-motors/generators, and micro-inductors, eddy currents and magnetic saturation start to limit the performance of these devices. In this paper, we present [...]

MEMS Technologies for Communications

Nguyen C.T.-C., DARPA/MTO, US

Micromechanical (or umechanical) communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible MEMS-based receiver front-end architectures are [...]

Fabrication of 3-Dimesional Cu Coaxial Cylinder using Porous Silicon MEMS Technology

Eun D.S, Kim Y.M., Bae CH.H., Lee J-H., Kyungpook National University, KR

Therefore, this paper reports 3-dimensional Cu coaxial cylinder with a thick OPS(oxidized porous silicon) in low resistivity silicon for application of microwave and RF integrated circuit technology. A novel on-chip 3D coaxial cylinder was fabricated [...]

Numerical Simulations of Novel Constant-Charge Biasing Method for Capacitive RF MEMS Switch

Lee J., Goldsmith C., University of Texas at Dallas, US

In the capacitive RF MEMS SW, it has been shown that every 5V of increased actuation voltage decreases the lifetime by an order of magnitude. In this paper, a novel method for automatically controlling the [...]

Design Optimization of Micromachined High Aspect Ratio 3D On-Chip Solenoid Inductor

Chomnawang N., Lu H., Colinjivadi K., Lee J., University of Texas at Dallas, US

We report the simulation work done by using Sonnet EMÔ on high aspect ratio (1:4 and 1:8) 3D on-chip air-core solenoid inductors. Simulations on 2, 3, and 5-turn inductors with 200 and 400 mm high [...]

RF-MEMS Voltage Tunable Capacitor using Electrostatic Forces

Lee J., Kim Y., Na D., Park S., Kyungpook National University, KR

In this paper, we have proposed a fabrication method of a RF-MEMS voltage tunable capacitor using Au-electroplating technique, which has one movable parallel plate with various structure of beams. We applied an electrostatic method and [...]

Ultra Thin Packaging of the RF-MEMS Devices with Low loss

Park H-W., Park Y.K., Kim C.J., Kim H., Kim Y.K., Kim C.J., Kim H., Kim Y.K., Lee D.J., Park H-W., Park Y.K., Kim C.J., Kim H., Kim Y.K., Ju B.K., Korea Institute of Science and Technology, KR

RF-MEMS devices have the potential for providing an overarching circuit integration technology that can significantly reduce the size, weight and cost. In this research, as ultra thin silicon substrate which has thickness of 50um was [...]

Accurate Modeling for RF Silicon MOSFET up to 15 GHz and the Parameter Extraction Methodology

Lin J., Kiat Seng Y., Jian Guo M., Manh Anh D., Nanyang Technological University, SG

The accurate method to extract a small-signal subcircuit model of MOSFET’s based on BSIM4 is presented, a novel approach to determining the parasitic inductances by Z-parameters, the intrinsic terminal resistance and capacitance by Y-parameters are [...]

Changing the Paradigm for Compact Model Integration in Circuit Simulators Using Verilog-A

Mierzwinsk M., Halloran P.O., Troyanovsky B., Dutton R., Tiburon Design Automation, Inc., US

Verilog-A has been demonstrated to be a suitable language to describe analog models. However, effective adoption by both the Electronic Design Automation (EDA) industry and end users requires that the language implementation provide all of [...]