Therefore, this paper reports 3-dimensional Cu coaxial cylinder with a thick OPS(oxidized porous silicon) in low resistivity silicon for application of microwave and RF integrated circuit technology. A novel on-chip 3D coaxial cylinder was fabricated by bulk and surface micromachined process. It was utilized deformation of sacrificial photoresist and electroplating and etching. In conclusion, we propose a novel 3-D coaxial cylinder structure fabricated by anodic reaction, electroplating, and micromachining technology. The structure is expected to improve the insertion loss characteristics, the transmission line dispersion characteristics and can be used as micro-size coaxial cylinder.
Journal: TechConnect Briefs
Volume: 2, Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 2
Published: February 23, 2003
Pages: 400 - 403
Industry sector: Sensors, MEMS, Electronics
Topics: Modeling & Simulation of Microsystems