Ultra Thin Packaging of the RF-MEMS Devices with Low loss

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RF-MEMS devices have the potential for providing an overarching circuit integration technology that can significantly reduce the size, weight and cost. In this research, as ultra thin silicon substrate which has thickness of 50um was used as capping substrate, we proposed ultra thin chip size RF-MEMS packaging technology that has vertical feed-through, ultra thin thickness (

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Journal: TechConnect Briefs
Volume: 2, Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 2
Published: February 23, 2003
Pages: 384 - 387
Industry sector: Sensors, MEMS, Electronics
Topics: Modeling & Simulation of Microsystems
ISBN: 0-9728422-1-7