Nguyen C.T.-C. – TechConnect Briefs

MEMS Technologies for Communications

Micromechanical (or umechanical) communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible MEMS-based receiver front-end architectures are [...]

Diamond Materials for MEMS and NEMS Structures and Devices

Butler J.E., Feygelson T., Sekaric L., Craighead H., Wang J., Nguyen C.T.-C., Naval Research Laboratory, US

Diamond materials offer great potential for many MEMS and NES applications. Amongst the attractive technological properties of diamond materials are the high stiffness, thermal conductivity, optical transparency range, chemical stability and erosion resistance, and dopant [...]

MEMS Technologies for Communications

Nguyen C.T.-C., DARPA/MTO, US

Micromechanical (or umechanical) communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible MEMS-based receiver front-end architectures are [...]