CN – Page 3 – TechConnect Briefs

Mass Production and Application of Electrospun Polyimide Porous Membranes for Li-Ion Battery

Wang X., Chen L., Hou H., Jiangxi Normal University, CN

To date, the electrospun nanofiber nonwovens or self-supporting electrospun porous membranes have, however, not been produced in a large scale. In this presentation, we introduce a way to the mass production of electrospun polyimide porous [...]

A Combined Photoelectrochemical and Theoretical Study to Understand Adsorption Properties of Organic Molecules on TiO2 Surfaces

Sun T., Yunnan University, CN

Titanium dioxide (TiO2) applications in clean energy generation and environmental remediation involve interactions between organic species and TiO2 materials. Such interactions not only depend on the intrinsic properties of TiO2, but also on its surfaces [...]

Mobility Enhancement from Process-Induced Stress of T-FinFET and Compact Model Development

He J., Peking University Shenzhen SoC Key Lab., CN

It is an often measure that the process-induced stress has been used in advanced CMOS process platform to increase the carrier mobility so to enhance MOSFET performance. It has also a strong effect on the [...]

Synthesis By Two-step Growth Scheme For Fabrication of Hierarchical Micro/Nano-structured Mesoporous FePO4 Particles for High Performance Lithium-Ion Batteries

Dong B., Li G., Yang X., University of Nottingham Ningbo China, CN

Olivine lithium iron phosphate (LiFePO4) has been considered as a promising cathode material in fabrication of lithium ion battery because of its features of low cost, lower toxicity, higher stability, excellent capacity retention, extremely flat [...]

The Key Technologies of Laser Surface Texturing and the Relative Equipments

Fu H., Fu Y., Fu H., Fu Y., Hua X., Ji J., Ye Y., Kang Z., Chen T., Jiangsu University, CN

Recently, there are three challenges of engineering practices of surface texturing for the diversity of geometrical shapes and complex operating conditions of mechanical components, such as optimal design, machining and equipment. Our group has always [...]

A nanocrystalline materials production technique for simultaneously improving several properties

Wang S.G., Institute of Metal Research, Chinese Academy of Sciences, CN

The concept of nanocrystalline metallic materials was put forward by Prof. Gleiter in 1980s [1]. From then on, nanocrystlline metallic materials have been extensively studied by the scientists all over the world [2]. The first [...]

Effect of Ambient Pressure and Wire Parameters on Nanoparticle Characteristics during Microsecond Explosion of Aluminum Wire

Bai J., Shi Z., Wu Z., Jia S., Xi'an Jiaotong University, CN

Al nanoparticles have important applications in various fields, e.g., solid rocket propellant, explosives [1], electronics [2], detection of biomolecules [3], and enhancement of the properties of various nanocomposites [4-6], etc. Among various synthesis methods of [...]

Printed via technology for oxide thin film transistors and inverters

Xie M.L., Wu S.J., Wu X.Z., Chen Z., Wu S.J., Wu X.Z., Cui Z., Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences, CN

In recent years, printed electronics starts to evolve from single components to systems where interconnects are essential for transistors to be connected into circuits. For complicated electronic circuits systems such as integrated circuit (IC), multilevel [...]

Design and Simulation of Electrostatic Imaging System based on MEMS

Li M-X, Chen X., Pan X., Kang J-S., Beijing Institute Technology, CN

The electrostatic imaging system obtains the contour profile of charged target by sensing the electrostatic field around. MEMS technology has the characteristic of microelectronic integration and miniaturization. In this paper, an electrostatic imaging system is [...]

A New Method to Fin-width Line Edge Roughness Effect Simulation of FinFET Performance

Zhu Y., Zhao W., Wang W., Wu W., Feng Z., He J., He P., He J., He P., Song L., Peking University Shenzhen SOC Key Laboratory, CN

This paper developed a full three-dimensional (3-D) statistical simulation method to investigate Fin-width Line Edge Roughness (LER) effect on the FinFETs performance. The line edge roughness is introduced by Matlab program, and then the intrinsic [...]