Papers:
Compact Thermal Model for Transient Temperature Fields in Electronic Systems
A thermal model is presented, which describes the evolution of the temperature distribution in electronic systems. Introducing a set of deliberately chosen effective time constants, the time dependence is given by convolution integrals with the [...]
An Algorithm for the Inclusion of RC Compact Models of Packages into Board Level Thermal Simulation Tools
The paper presents an algorithm for the co-simulation of packages, given with the RC compact models, and the printed circuit boards. This enables beyond the correct detailed consideration of the heat transfer in the board [...]
Physics-Based and Compact Models for Self-Heating in High-Speed Bipolar Integrated Circuits
We present three-dimensional heat-transport simulation for bipolar transistors. The simulations are validated on experimental data, and are employed to develop analytical models for the thermal resistance of devices fabricated on bulk and SOI substrate, and [...]
Extraction of Coupled RLC Network from Multi-level Interconnects for Full Chip Simulation
In this paper, an approach is proposed for extracting coupled RLC network from multi-level interconnects. The proposed approach starts with a step of partitioning the layout of the full-chip under consideration into several sub-layouts, followed [...]
Simulation of Heterojunction Bipolar Transistor with Domain Decomposition Method
Domain decomposition method is used in simulation of the band profile and the majority carrier concentration profile of AlGaN/GaN heterojunction bipolar transistors. The method is very stable and efficient. With this method different device structures [...]
Compact Modeling of Tunneling Breakdown in PN Junctions for Computer-Aided ESD Design (CAD for ESD)
This paper presents compact, physically-based electrothermal models for direct as well as indirect bandgap tunneling processes in pn-junctions for use in network simulators (e.g. Saber or VHDL-A). The model for indirect tunneling has been validated [...]
Characterization of “Multipath Interconnects” for Microelectronic and Nanotechnology Circuits
A multipath interconnect carries a signal by using the concept of parallel processing by providing two or more paths between the driver and the load. These paths are stacked vertically isolated from one another by [...]
Novel Computing Architecture on Arrays of Josephson Persistent Current Bits
A superconducting qubit (or quantum bit), which consists of a micrometer-sized loop with three Josephson junctions, has two persistent currents of opposite direction as its two states. The states of the qubit can be brought [...]
The New Approach to the Power Semiconductor Devices Modelling
Due to their specific structures the power devices need special models different from those developed for low power electronics. The development of such special models is far from being simple as distributed nature of phenomena [...]
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems
Published: April 22, 2002
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9708275-7-1