Thermo-Mechanical Characterization and Integrity Checking of Packages and Movable-Structures
Bognar Gy., Courtois B., Horvath Gy., Perlaky G., Poppe A., Rencz M., Ress S., Szabo P., Székely V., Budapest University of Technology and Economics, HU
The paper will present a variety of possibilities for the thermal characterization of different movable MEMS devices and packaging. It will discuss the major difficulties in these methodologies and the ways to overcome them. Comparison [...]