Rencz M. – TechConnect Briefs

Thermo-Mechanical Characterization and Integrity Checking of Packages and Movable-Structures

Bognar Gy., Courtois B., Horvath Gy., Perlaky G., Poppe A., Rencz M., Ress S., Szabo P., Székely V., Budapest University of Technology and Economics, HU

The paper will present a variety of possibilities for the thermal characterization of different movable MEMS devices and packaging. It will discuss the major difficulties in these methodologies and the ways to overcome them. Comparison [...]

Design and Verification of an Electrostatic MEMS Simulator

Bognar G., Charlot B., Ciontu F., Courtois B., Rencz M., Székely V., Micred, HU

Thermal solvers can be used for the simulation of electro-static problems as well, since the main equations to be solved are the same: the so-called field equation. There are numerous thermal solvers on the market, [...]

Algorithmic and Modeling Aspects in the Electro-thermal Simulation of Thermally Operated Microsystems

Courtois B., Poppe A., Rencz M., Székely V., Micred, HU

A new algorithm has been developed for the layout based electro-thermal simulation of integrated circuits and MEMS, using simultaneous iteration. The general advantage of this method over simulator coupling is that, in contrast with the [...]

An Algorithm for the Inclusion of RC Compact Models of Packages into Board Level Thermal Simulation Tools

Courtois B., Rencz M., Székely V., TIMA-CMP, FR

The paper presents an algorithm for the co-simulation of packages, given with the RC compact models, and the printed circuit boards. This enables beyond the correct detailed consideration of the heat transfer in the board [...]

A Method for Thermal Model Generation of MEMS Packages

Courtois B., Kohári Zs., Rencz M., Székely V., Micred Ltd., HU

MEMS applications are frequently thermally operated, so knowing the thermal characteristics of their packages is very important. This paper presents a method for the generation of reduced order dynamic thermal models, either from simulated or [...]

SUNRED: A Field Solver and Compact Model Generator Tool Based on Successive Node Reduction

Páhi A., Rencz M., Rosenthal M., Székely V., Techical Unviersity of Budapest, HU

The paper presents the new features of the SUNRED field solver program: the visualization of the structures in the 3D version, and the new dynamic simulation methods. Comparisons with other field solvers demonstrate the superior [...]

Thermal Simulation Tools for Microsystem Elements

Hajder Sz., Páhi A., Poppe A., Rencz M., Székely V., Technical University of Budapest, HU

Two different field solver tools have been developed in order ro facilitate fast thermal and electro-static simulation of microsystem elements. The pSTHERMANAL program is capable for the fast steadystate and dynamic simulation of suspended multilayered [...]