Characterization of “Multipath Interconnects” for Microelectronic and Nanotechnology Circuits

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A multipath interconnect carries a signal by using the concept of parallel processing by providing two or more paths between the driver and the load. These paths are stacked vertically isolated from one another by insulating layers between them. In this paper, we have used the Green’s function method to determine the parasitic capacitances associated with a system of multipath interconnects printed on a silicon-based substrate.

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Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems
Published: April 22, 2002
Pages: 632 - 635
Industry sector: Sensors, MEMS, Electronics
Topics: Modeling & Simulation of Microsystems
ISBN: 0-9708275-7-1