TechConnect Briefs
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
Home2006May

Month: May 2006

TechConnect Proceedings Papers

Analytic Damping Model for a Square Perforation Cell

Veijola T., Helsinki University of Technology, FI
A compact model for a square perforation cell is derived. It is generated both analytically and with 3D FEM simulations of the structure. The model consists of six flow resistances, whose values are simple functions [...]

MEMS Process Characterization with an on-Chip Device

Garmire D., Choo H., Muller R.S., Govindjee S., Demmel J., UC-Berkeley, US
We have developed a CMOS-compatible, compact device and a simple procedure for measuring three important fabrication characteristics of planar-processed microelectromechanical (MEMS) structures: in-plane over- or under-cut, Young’s Modulus, and comb-drive forces in a MEMS process. [...]

Mechanical Properties Measurements of 0.35-µm BiCMOS MEMS Structures

Liu J., Fedder G.K., Sassolini S., Sarkar N., Carnegie Mellon University, US
A new Young’s modulus test structure has been designed and used in our lab. Simple models have been built in simulating lateral and vertical stress gradients. Test structures, measurements and FEA simulations are reported on [...]

Optimization of Piezoelectric Transformers Using Elite Genetic Algorithm

Kang C-Y., Lee C-K, Yang Y-J, National Taiwan University, TW
In this work, we present the optimization work for piezoelectric transformers (PT) by using the elite Genetic Algorithm (GA). The Finite-element solver, NTUPZE, is used to calculate the behaviors of piezoelectric transformers. The design parameters [...]

Correlation of Experimental and Numerical Results on Electrostatically Actuated Micro-Beams

Rochus V., Rixen D.J., Golinval J.-C., University of Liege, BE
The aim of this paper is to validate numerical simulations of electromechanical coupling in micro-structures using some experimental results. The micro-structures studied here consist in a micro-bridge and two cantilever beams. Multi-physics simulations of micro-electro-mechanical [...]

Adaptive temperature estimation in 3D single-cell dielectrophoretic traps using the boundary Element Method

Rosales C., Institute of High Performance Computing, A*STAR, SG
Application of dielectrophoresis techniques to biological particles is limited by the temperature increase of the suspension due to Joule heating. This temperature increase can be obtained from a Poisson equation, but the presence of the [...]

Numerical Capacitance Calculation for Mems Pressure Sensor by Method of Moments

Li P., Weber R.J., Iowa State University, US
MEMS-based capacitive pressure sensors have been widely used in many engineering applications. The design of a MEMS capacitance pressure sensor presents a number of challenges, one of which is the calculation of sensor capacitance and [...]

A Generic Scientific Simulation Environment for Multidimensional Simulation in the Area of TCAD

Heinzl R., Spevak M., Schwaha P., Grasser T., Institute for Microelectronics, AT
We will resented a completely generic scientific environment suitable for thearea of TCAD. Therewith it is possible for scientists to use a completetopological and numerical environment to develop applications with minimumoverhead or great knowledge of [...]

Stability of micro and nano devices actuated by Casimir forces

Hernández J., Esquivel-Sirvent R., Instituto de Fisica, UNAM, MX
The effect of the Casimir force in micro and nano electromechanical systems (MEMS/NEMS) is examined taking fully into account the dielectric properties of the materials as well as the finite thickness of movable elements in [...]

Analytical Models for Quantized Sub-Band Energy Levels and Inversion Charge Centroid of MOS Structures Derived from Asymptotic and WKB Approximations

Abebe H., Cumberbatch E., Morris H., Tyree V., USC/ISI, US
Quantum effects on MOS structures investigation.

Posts pagination

« 1 … 7 8 9 … 66 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.