TechConnect Briefs
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
Home2006May

Month: May 2006

TechConnect Proceedings Papers

Application of a Design Methodology Using a 2D Micro Scanner

Anac O., Basdogan I., Koc university, TR
Micro Electro Mechanical Systems (MEMS) are the new and emerging technology of the future and have many applications on different disciplines like biomedical, imaging technology, biology etc. Characterization of motion and vibrations of such systems [...]

Modelling of Torsional Micromirrors with Springs made of Multiple Rotational Serpentine Elements

You J., Packirisamy M., Stiharu I., Concordia University, CA
In general, this paper presents the deduced analytical model and numerical simulation of electrostatically actuated torsional micromirrors with two symmetrical side springs of multiple rotational serpentine elements. Modelling of these kinds of micromirrors is carried [...]

Smart Pressure Sensor on SOI optimized by Finite Element Analysis for Heatspreader Integration

Bercu B., Montès L., Morfouli P., INPG-MINATEC, FR
Finite element analysis is used to maximize the response of the piezoresistive pressure sensor into an integrated heatspreader, designed for high-power electronic device cooling. This study shows the possibility of obtaining small area piezoresistive pressure [...]

Multiphysics Modeling and Simulation for a MEMS Thermal-Mechanical Switch

Wang W., Popuri R., Onishi S., Bumgarner J., Langebrake L., University of South Florida, US
This paper presents the results of finite element analysis (FEA) modeling and simulation including thermal-electric-structural multiphysics contact phenomenon for a MEMS thermal-mechanical DC switch. The parametric model can be used for design optimizations.The switch consists [...]

Manipulation of Capillary force by Electrowetting for Micromanipulation

Chandra S., Batur C., University of Akron, US
Microassembly is the future of MEMS and NEMS technology. But greatest barrier to the idea of micro scale assembly is micromanipulation. The steps in micromanipulation are pickup, moving and releasing and the most difficult part [...]

Strong and Weak Inversion Mode of MOS in the Design of Direction Sensitivity Matrix

Husak M., Boura A., Jakovenko J., Czech Technical University in Prague, CZ
In the article there is presented a new arrangement of a temperature sensor system for air velocity and direction measurement. The system utilizes temperature dependence of the current through the channel of MOS structure. The [...]

Parameterizable Library Components for SAW Devices

Wilson W.C., Atkinson G.M., NASA Langley Research Center, US
The lack of integrated design tools for SAW devices has led us to develop tools that in the future will enable integrated design, modeling, simulation, analysis and automatic layout generation of Surface Acoustic Wave (SAW) [...]

Microcantilever Sensor via Second Order Sliding Mode Control

English J., Shtessel Y., Yegnaraman M., George M., University of Alabama in Huntsville, US
Improved sensor measurements using second-order sliding mode control of a mass sensor based on a microcantilever is considered. The microcantilever-based mass sensor detects mass loading via deflections in nanometer scale. The polymer-coated cantilever is exposed [...]

Adaptive Control for Reducing the Effect of Damping on the Output Signal of Microgyroscopes

Khalilyulin R., Hauck T., Wachutka G., Münich University of Technology, DE
A mixed-level modeling methodology is employed to set up a full system simulation model for microgyroscopes together with the control circuitry in order to investigate the performance of novel adaptive closed-loop control strategies, which allow [...]

Simulations of the Anchor Losses in MEM Disk Resonators

Paci D., Stoffels S., Tilmans H.A.C., IMEC, BE
MEM (Micro Electro Mechanical) resonators have been proposed as fundamental components in RF transmission systems; especially bulk mode resonators are very attractive devices because of their small size and their high resonance frequencies combined with [...]

Posts pagination

« 1 … 6 7 8 … 66 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.