TechConnect Briefs
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
Home2005May

Month: May 2005

TechConnect Proceedings Papers

A Parallel Intelligent OPC Technique for Design and Fabrication of VLSI Circuit

Yu S-M., Li Y., National Chiao Tung University, TW
Optical lithography is the key technology used in very large scale integrated (VLSI) circuit and systemon- a-chip (SoC) fabrication [1-3]. The exposure on wafer has distortions due to the proximity effects. Hence, a correction of [...]

Web Based Distributed Computing Environment for Nanotechnology

Chen D., Raghunathan A., Mashl J., Chiu S., Parker S., Aluru N., Jakobsson E., NCSA at UIUC, US
One promising path of computational nanoscience is the integration of device design tools and computational chemistry tools to design molecular device components. In order to improve the efficiency of the design process and also let [...]

Linear Analysis of Large Deflection of Heated and Clamped Isotropic Layered Plate Under Initial Tension

Chen C-F, Yu J.C., Chung-Hua University, TW
A simplified linear problem is studied for the large deflection of a clamped and heated isotropic circular layered plate under pretension and uniform loading (Fig. 1 and 2). Including a thermal consideration, governing equations based [...]

A Computational Model with Experimental Validation for DNA Flow in Microchannels

Nonaka A., Gulati S., Trebotich D., Miller G.H., Muller S., Liepmann D., UC Davis / Lawrence Livermore National Laboratory, US
We compare a computational model to experimental data for DNA-laden flow in microchannels. The purpose of this work in progress is to validate a new numerical algorithm for viscoelastic flow of an Oldroyd-B fluid. Significant [...]

Model for Compression of Fullerenes and Carbon Nanotubes

Jindal P., Jindal V.K., Jindal P., Jindal V.K., Panjab University, IN
This abstracts highlights methodology to use fullerene and carbon nanotubes to utilize their empty space for high pressure absorbing capabilities.

Finite Element Modeling of Electro-Mechanical Coupling in Capacitive Micro-Systems

Rochus V., Rixen D.J., Golinval J.-C., University of Liege, BE
The aim of this paper is to deal with multi-physics simulation of micro-electro-mechanical systems (MEMS) based on an advanced numerical methodology. MEMS are very small devices in which electric as well as mechanical and fluid [...]

A Wavelet Method for the Density-Gradient Equation

Morris H., Limon A., San Jose State University, US
As MOSFET device lengths have shrunk to submicron level, so too has the oxide thickness steadily reduced. At around 4-5nm thicknesses quantum effects start to become noticeable as electrons are able to tunnel through the [...]

Electron Energy States of INAS/GAAS Quantum Ring Array

Filikhin I., Deyneka E., Melikian G., Vlahovic B., North Carolina Central University, US
Planar array of semiconductor quantum rings is studied under the energy dependent effective mass approximation. Rectangular shape InAs quantum rings (QR) are embedded into the GaAs substrate. The 3D confined energy problem is solved numerically [...]

3-Dimensional Diffusion-Reaction Model for DNA Hybridization on Microarrays

Pappaert K., Baron G.V., Desmet G., Free University of Brussels, BE
Molecular diffusion limits the hybridization rate in microarrays, leading to overnight waiting times. During the last couple of years a large number of methods were developed to overcome this diffusion-limitation and to enhance the speed [...]

Investigation of Local-Strain Effect of the Nano-Scale Triple Gate Si/SiGe and SiN/Si Stacking MOS Transistor

Chang C.H., Chou C.Y., Peng C.T., Han C-N, Chiang K.N., National Tsing Hua University, TW
The tensile strained Si, based on the misfit between Si and SiGe gives higher speed and higher drive current for the metal oxide silicon field effect transistors. Based on the strained Si technology, a tri-gate [...]

Posts pagination

« 1 … 8 9 10 … 69 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.