Papers – Page 20 – TechConnect Briefs

Optical Surface Diffraction and Improved Lateral Resolution

Bacsa W.S., Caumont M., CNRS, UPS, BU, US

Optical coherence plays an important role in the local field in the vicinity of surfaces where the incident and scatter field overlap (1). While phase differences are small in the optical nearfield, the longitudinal component [...]

Nano Tungsten Silicide Thin Film Deposition and its Integration with Poly-Silicon

Li M., Suryanarayanan Iyer R., Applied Materials Inc., US

The semiconductor transistor of 90 nm or below generation requires low resistance materials for gate metallization. A thin tungsten silicide (WSix) film is a candidate for the buffer material between poly-silicon and metal, such as [...]

Nanoscale Reaction Analysis of Resist Materials for Nanolithography

Kozawa T., Saeki A., Okamoto K., Tagawa S., Osaka University, JP

Recently, in semiconductor industry, elaborate extension of photolithography is getting closer to its capacity limit and post-optical lithographies have attracted much attention ever. Because they are capable of fabricating features below 32 nm, they are [...]

A Highly Reliable Pattern Transfer of Hydrogen Silsequioxane

Liu J.F., Chen H.J.H., Chen S.Z., Chen H.J.H., Chen S.Z., Huang F.S., National Tsing Hua University, TW

In this paper, we focus on the effects of process parameters on pattern embossing into HSQ films, and the pattern degradation of HSQ for room temperature aging effects. The dilution of HSQ affects not only [...]

Sub-100nm and Large Area Pattern Process using by Hybrid Nanocontact Printing (HnCP)

Jo J., Kim K-Y, Choi D.S., Lee E-S, Korea Institute of Machinery & Materials(KIMM), KR

The hybrid nanocontact printing(HnCP) method is a technology for manufacturing an ultra violet(UV) imprinted silicon substrate from a master and then printing by letting it get in contact with a substrate coated with a metal [...]

Au Nano-Wire Transferring onto HSQ by Nano Imprinting Technology

Liu J.F., Hsu Y.J., Chen J.H., Chen S.Z., Huang F.S., Chen J.H., Chen S.Z., National Tsing Hua University, TW

In this paper, we present the technique of transferring Au nano-wire on HSQ by using nano imprint. The Au nano-wires were fabricated by electroless-plating and investigated by TEM analysis. The stable nano imprinting and suitable [...]

Low Voltage Electron Beam Lithography in PMMA

Bolorizadeh M., Joy D.C., University of Tennessee, US

To examine the practical limits and problems of low voltage operation, we have studied electron beam lithography (EBL) in the low (few keV) to ultra-low (E < 100eV) energy range, employing commonly used resists such [...]

Aspect Ratio Improvement using the 2-step NERIME FIB Top Surface Imaging Process for Nano-lithography Applications

Arshak A., Arshak K., Gilmartin S.F., Collins D., Korostynska O., Arshak A., Arshak K., University of Limerick and Analog Devices, IE

The 2-step NERIME FIB top surface imaging process uses Ga+ ion implantation into resist followed by O2 plasma dry development using reactive ion etching. Previous work has demonstrated this process using 1.5um thick films of [...]

Self-Assembled Cluster Nanostructures and Nanodevices

Brown S.A., Partridge J., Scott S., Reichel R., Ayesh A., Tee K.C., Nano Cluster Devices Ltd, NZ

In this paper we will review our efforts over the last few years to achieve contacted electronic devices which are self-assembled from atomic clusters. The focus is on the assembly of nanowires but many aspects [...]

Wafer Scale Aligned Sub-25nm Metal Nanowires on Silicon (110) using PEDAL Lift-off Process

Sonkusale S.R., Amsinck C.J., Nackashi D.P., Di Spigna N.H., Barlage D., Johnson M., Franzon P.D., North Carolina State University, US

We have demonstrated a new PEDAL process to make sub-25 nm nanowires across the whole wafer. The PEDAL process is useful in the fabrication of metal nanowires directly onto the wafer by doing shadow metalization [...]