Papers – Page 27 – TechConnect Briefs

An Electrothermal Solution of the Heat Equation for MMICs Based on the 2-D Fourier Series

Giorgio A., Perri A.G., Politecnico di Bari, IT

In this paper a 2-D Fourier transform-based analytical method for the thermal and electrical solution of multilayer structure electronic devices is proposed. In particular this paper presents an analytical procedure for the thermal and electrical [...]

Numerical Analysis of Nano-imprinting Process Based on Continuum Hypothesis

Kim B.S., Kim H-C, Woo Y.S., Lee W.I., Oh S.I., Kim B.S., Kim H-C, School of Mechanical and Aerospace Engineering, Seoul National University., KR

Nano-imprint lithography (NIL) is a processing tech-nique capable of transferring nano-scale patterns onto a thin film of thermoplastics such as polymethyl methacrylate (PMMA). Feature sizes down to 10 nm have been demonstrated to be made [...]

Microscope Slide Electrode Chamber for Nanosecond, Megavolt-Per-Meter Biological Investigations

Sun Y., Vernier P.T., Behrend M., Marcu L., Gundersen M.A., University of Southern California, US

Nanosecond pulsed electric fields pass through the external membranes of biological cells (which have typical response times much greater than nanoseconds) and perturb fast-responding intracellular structures and processes. To enable real-time imaging and investigation of [...]

Inverse RIE Lag of Silicon Deep Etching

Chung C.K., Chiang H.N., National Cheng Kung University, TW

This paper reports for the first time that the phenomena and reaction mechanism of inverse reactive ion etching (RIE) lag occurs in the silicon deep RIE process without feature coalescence. This phenomenon is related to [...]

Process Factors in the Reduction of Output Conductance in Sub-micron CMOS

May N.C., Tan H.S., Kordesch A.V., SILTERRA (M) SDN BHD, MY

CMOS Analog circuits require transistors with low output conductance (gds) in order to achieve high gain. Submicron MOSFETs with halo implants and retrograde wells are designed to have high transconductance (gm) but often suffer from [...]

Planarize the Sidewall Ripples of Silicon Deep Reactive Ion Etching

Weng K-Y, Wang M-Y, Tsai P-H, Industrial Technology Research Institute, TW

In order to diminish the sidewall defects in silicon deep reactive ion etching process, depositing doped silicon dioxide and post-annealing processes are applied. Compared with conventional approaches, the filling-reflow surface shows nearly optical quality. the [...]

A Novel Method for Determining Optimum Etch Times for the One Step Dry Release Proces

Docker P.T., Kinnell P.K., Ward M.C., The University of Birmingham, UK

This paper details a novel method for determining the optimum etch times for releasing structures when using the authors one step dry release process. By using self releasing structures known as waffles the exact point [...]

Bottom-Up meets Top-Down – A Novel Approach towards 3-D Optical Devices

Houbertz R., Cochet S., Domann G., Popall M., Serbin J., Ovsianikov A., Chichkov B.N., Fraunhofer ISC, DE

Inorganic-organic hybrid polymers suitable for optical applications, were synthesized by catalytically controlled hydrolysis/polycondensation reactions. The resulting resins are build-up by organically functionalized nm-size primary particles (oligomers). Due to the variety of alkoxysilanes and synthesis parameters, [...]

Direct Scanning Laser Writing of 3D Multilayer Microstructures

Yu H., Li B., Zhang X., Boston University, US

Material processing with lasers is an expanding field since it not only makes manufacturing cheaper, faster, cleaner, and more accurate but also opens up entirely new technologies and manufacturing methods that are simply not available [...]

Batch Fabrication of Microsensor Arrays by TiO2 Nanoparticle Beam Deposition

Milani P., Barborini E., Piseri P., Iannotta S., Siciliano P., Universita' di Milano, IT

Here we present the production and characterization of chemical microsensors based on nanostructured TiO2 deposited on microfabricated platforms. Aerodinamically filtered supersonic cluster beam deposition allows to control the nanoparticle size and to deposit in batch [...]