Papers – Page 31 – TechConnect Briefs

Wafer-Level High Density Multifunctional Integration (HDMI) for Low-Cost Micro/Nano/Electro-Opto/Bio Heterogeneous Systems

Gutmann R.J., Lu J-Q, McMahon J.J., Persans P.D., Cale T.S., Eisenbraun E.T., Castracane J., Kaloyeros A.E, Rensselaer Polytechnic Institute, US

A technology platform -wafer-scale high density multifunctional integration (HDMI) -is described which offers the potential for low-cost integration of information processing and sensor/actuator technologies for future microelectronic, nanoelectronic, mixed electro-optical and bio-molecular systems. The HDMI [...]

Parallel Plate Plasma Etching for MEMS Processing-Reactor Modelling

Babarada F., Dunare C., Profirescu M., University Politehnica Bucharest, RO

The model presented analyses the uniformity of dry etching polyslicon films which are used in resonator cavity for MEMS fabrication/1,2/. The increase of the uniformity is very important for nanotechnology and very strong required of [...]

A Fluoro-ethoxysilane-Based Stiction-Free Release Process for Submicron Gap MEMS

Parvais B., Pallandre A., Jonas A.M., Raskin J-P, Université catholique de Louvain, BE

Nowadays, stiction remains one of the biggest reliability problems in the fabrication of micro-electromechanical systems (MEMS), especially when a small gap is used. To avoid the adhesion, a Self-Assembled Monolayer (SAM) can be coated. Main [...]

Introduction of Micro-Manipulation by Adhesional Force and Dielectric Force

Takahashi K., An Y., Saito S., OnzawaTadao T., Tokyo Institute of Technology, JP

This paper reports the manipulation by both adhesional force and Coulomb force. Applicability of this method is discussed evaluating both of the forces theoretically and experimentally. Adhesional force can be used as attractive force in [...]

A Study on the Fabrication of Micro Structure using Chemical Mechanical Micro Machining Process

Park J.M., Lee H.W., Jeong H.D., Pusan National University, KR

Single crystal silicon is widely used in the microelectronic industry. Recent advances in ultra precision machining have enabled the possibility of direct diamond turning of high quality surfaces on the brittle materials. As a brittle [...]

Modeling and Simulation of Micromachined Needles

Zhang P., Jullien G.A., University of Calgary, CA

The research and development of microneedles are reviewed briefly and microneedles are classified. The features of those microneedles are analyzed and discussed. Based on those analysis, a new microneedle structure has been proposed. Those microneedles [...]

A New, Topology Driven Method for Automatic Mask Generation from Three-Dimensional Models

Schiek R., Schmidt R., Sandia National Laboratories, US

We have developed an algorithm which when given a three-dimensional object can infer from the objects topology the two-dimensional masks needed to produce that object with surface micromachining.Our algorithm, called Faethm, calculates the required two-dimensional [...]

Fabrication of High Quality PZT Thick Film Using Lift-Off Technique

Zhao H.J., Ren T.L., Liu J.S., Liu L.T., Liu J.S., Liu L.T., Li Z.J., Liu J.S., Liu L.T., Institute of Microelectronics, Tsinghua University, CN

Lead-zirconate-titanate (PZT) is a typical ferroelectrical material with outstanding properties. The demand for the thickness of PZT films used in MEMS is usually over 1_m due to the advantages of the thick thin films, so [...]

Fabrication of 3D MEMS Antenna Array for Infrared Detector Using Novel UV-Lithography Apparatus, Plastic Micro Machining and Micro Assembly Technique

Park J.Y., Kim K.T., Moon S., Pak J.J., Korea Institute of Science and Technology, KR

This paper describes the novel UV-Lithography technique for fabrication of 3D feed horn mold structure array using implementation of mirror reflected parallel beam illuminator(MRPBI) system, fabrication of 3D feed horn MEMS antennas plate using plastic [...]

Characterization of Microscale Material Behavior with MEMS Resonators

White C.D., Xu R., Sun X., Komvopoulos K., University of California-Berkeley, US

The reliability of MEMS devices greatly depends on precise characterization of material behavior at the micron scale. This paper presents a novel material characterization device for fatigue testing. The fatigue specimen is subjected to multi-axial [...]