Papers – Page 32 – TechConnect Briefs

A Modeling Approach based on Laminated Plate Theory to Design Microbeams

Mantell S.C., Longmire E., Wolters D., University of Minnesota, US

MEMs microbeams consist of many thin material layers. This thin layered structure is very similar to that of laminated composite plates in which thin layers of fiber reinforced plastic are stacked and cured. Both the [...]

Adaption of the 3w-Method for Testing of MEMS

Raudzis C., Schatz F., Wharam D., Corporate Research, Robert Bosch GmbH, DE

Automated wafer level testing of MEMS requires methods to measure geometry and material related parameters by purely electrical means. The three omega method to measure the thermal conductivity seems to be appropriate for this task. [...]

Modeling Electrothermal Plastic Deformation

Geisberger A., Sarkar N., Ellis M., Skidmore G., Zyvex Corporation, US

Self-assembly of three-dimensional microstructures has been achieved using EPDA (Electrothermal Plastic Deformation Assembly). The EPDA process, in this case, is dependent on gold yielding within a gold and polysilicon bimorph. To plastically deform the bimorph [...]

Frequency Tuning of Silicon Micromechanical Cantilevers by Laser Ablation

Gallacher B.J., Hedley J., Burdess J.S., Harris A.J., Newcastle University, UK

The high Q-factor and stability of micromechanical resonators makes them attractive for a range of applications such as R.F. filters [1] and resonant sensors [2]. In many cases, a specific resonant frequency is necessary for [...]

Diamond Materials for MEMS and NEMS Structures and Devices

Butler J.E., Feygelson T., Sekaric L., Craighead H., Wang J., Nguyen C.T.-C., Naval Research Laboratory, US

Diamond materials offer great potential for many MEMS and NES applications. Amongst the attractive technological properties of diamond materials are the high stiffness, thermal conductivity, optical transparency range, chemical stability and erosion resistance, and dopant [...]

Nano-bending Method to Identify the Residual Stresses of MEMS Films

Kim J.G., Kim J.H., Kim Y.H., Kim J.G., Kim J.H., Kim Y.H., Hahn J.H., Lee H.Y., Kim J.G., Kim J.H., Kim Y.H., Seoul National University, KR

Surface micro-machined MEMS frequently suffer from the residual stress which might significantly decrease the performance and reliability of micro devices. It is important to accurately measure the residual stresses at manufacturing step. The Stoney’s equation [...]

An efficient Adaptive Single-Mode (ASM) Pull-In Extraction Algorithm for Computer Aided Design of Electrostatic MEMS Devices

Elata D., Bochobza-Degani O., Nemirovsky Y., Technion – Israel Institute of Technology, IL

This paper presents a novel Adaptive Single-Mode (ASM) Pull-In extraction scheme for CAD of electrostatic MEMS. The scheme is 50 to 1000 times faster than various previously suggested methods. The extracted Pull-In parameters are shown [...]

NanoMuscle at the Nano-Frontier

Nash H., MacGregor R., Von Behrens P., Szilagyi A., NanoMuscle, US

Nano scale structures: Much excitement has been generated in recent years by nano-science breakthroughs. A common characteristic of such developments has been the discovery of novel properties of materials of common composition but with characteristic [...]

Nanoscience and Nanotechnology:Two New Exciting Fields for Future Display Applications

Yaniv Z., Applied Nanotech, Inc., US

Though just two years ago nanoparticles and nanotechnology were little more than a blip on the industrial applications radar, over 1 billion in annual venture capital is expected to be invested in the field in [...]

MEMS Technologies for Communications

Nguyen C.T.-C., DARPA/MTO, US

Micromechanical (or umechanical) communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible MEMS-based receiver front-end architectures are [...]