Papers – Page 11 – TechConnect Briefs

Stress Measurement in MEMS Devices

Starman Jr. L., Busbee J., Reber J., Lott J., Cowan W., Vandelli N., Wright-Patterson AFB, US

Due to the unique structure and small scale of Micro-Electro-Mechanical Systems (MEMS), residual stresses during the deposition processes can have a profound affect on the functionality of the MEMS structures. Typically, material properties of thin [...]

Three-Dimensional Effects Obtained from Capacitance Analysis of an SRAM Cell

Takemura Y., Osada K., Yagyu M., Yamaguchi K., Ushio J., Maruizumi T., Hitachi Ltd., JP

Employing Green's function method, we analyzed the 3D capacitance for the hole interconnect structure in an SRAM cell. We found novel 3D effects as follows; (1) via connection increases the capacitance of parallel lines, (2) [...]

Predictive and Calibrated Simulation of Doping Profiles: Low Energy As, B and BF2 Ion Implantation

Scheiblin P., Roger F., Poncet D., Laviron C., Holliger P., Laugier F., Guichard E., Caire J.P., LETI, FR

In this work, we propose calibrated models for predictive simulation of low energy Arsenic, Boron and BF2 ion implantation in the suitable range for sub-100nm CMOS technology. The International Technology Roadmap for Semiconductors (ed. 1999) [...]

Finite Element Analysis in the Development of MEMS-based Compound Grating (MCG)

Yao Y., Castracane J., Xu B., Olson S., Eisden J.V., University at Albany-SUNY, US

This paper presents the development of the 1 mm ruled MEMS-based Compound Grating (MCG) in which the structural material of the rulings is SiO2 coated with Cr/Au as the top electrode. The MEMS simulation package [...]

Modeling and Simulation on Two Passive Feedback Methods to Obtain Large Travel Range of Electrostatic Micro Mirrors

Wu X.T., Xiao Z.X., Zhe J., Farmer K.R., New Jersey Institute of Technology, US

This paper demonstrates two passive feedback methods to obtain increased travel range in electrostatic micro actuators directly in the electrostatic domain. The first method is modeled as a series capacitor loop in which an integrated [...]

Eigenvalue Analysis of Tunable Micro-mechanical Actuator

Lee W-S., Kwon K-C., Kim B-K., Cho J-H., Youn S-K., KAIST, KR

An eigenvalue analysis of a tunable micro-mechanical actuator is presented. The actuator is modeled as a continuum structure. The eigenvalue modified by the tuning voltage is computed through the linearization of the relation between the [...]

Modeling the Effects of Joint Clearances in Planar Micromechanisms

Wittwer J.W., Howell L.L., Chase K.W., Brigham Young University, US

Surface micromachining of micro-electro-mechanical systems (MEMS) has inherent limitations that can lead to mechanisms having an undesirable amount of clearance in revolute and prismatic joints. In micro devices, where actua-tion of the mechanisms is often [...]

Thermal Modeling of a Surface-micromachined Linear Thermomechanical Actuator

Lott C.D., McLain T.W., Harb J.N., Howell L.L., Brigham Young University, DE

The thermal behavior of a thermomechanical in-plane microactuator is modeled using a finite-difference approach. Steady-state temperature profiles from the model are presented for a microactuator operating in air and a vacuum. The model is validated [...]

Investigation into the Standardization of Micromechanical Components and their Simulation and Computation Using FEM — Case Study of Diaphragms

Weiss E., Welp E.G., Witzel U., Wieck A., Schmidt E., Ruhr University Bochum, DE

Although certain components (such as diaphragms or beams) are used recurrently in micromechanics, the degree of standardization of components that is familiear in classic mechanical engineering is still to a great extent unknown in this [...]

An Accurate Photodiode Model for DC and High Frequency SPICE Circuit Simulation

Swe T.N., Yeo K.S., Nanyang Technological University, SG

An accurate photodiode model for DC as well as high frequency SPICE circuit simulation is presented in this paper. The accuracy of the proposed model is verified with the measured data obtained from two different [...]