Papers – Page 10 – TechConnect Briefs

A Framework for Mask-Layout Synthesis Implementing a Level Set Method Simulator

Lee C.-Y., Antonsson E.K., California Institute of Technology, US

Recently, evolutionary methods have been developed to automate MEMS mask-layout synthesis [3]{[6]. These design synthesis methods are iterative searches in which each iteration consists of mask-layout modification, determination of etched shape via an arbitrary 3-D [...]

Semiempirical Direct Dynamics Trajectory Study of the Si+ (2P) + H2 -> SiH+ + H Reaction

Chaâbane N., Vach H., Peslherbe G.H., CNRS-Ecole Polytechnique, FR

Silicon chemical vapor deposition (CVD) is widely used in the microelectronic industry for the production of integrated circuits. For the underlying chemical reactions, the dynamical properties of the involved Si-H compounds are of fundamental interest. [...]

Diffusion Induced Stresses in Microstructures of MEMS

Yang F., University of Rochester, US

The diffusion-induced stresses in silicon wafers were studied. The effect of local electric field on dopant diffusion was considered in the diffusion equation. Only one-dimension problem with a constant surface dopant concentration was investigated. The [...]

Layout Verification and Correction of CMOS-MEMS Layouts

Baidya B., He K., Mukherjee T., Carnegie Mellon, US

The advent of CMOS micromachining has introduced new design rules for fabrication of integrated CMOS-MEMS devices. This paper presents a context dependent DRC algorithm to handle the issues related to pre-fabrication verification of such layouts. [...]

Modeling of Deposition Process by Level Set Method

Jung H., Kwon O., Yoon S., Won T., Inha University, KR

In this paper, we report a novel method for effectively reducing the amount of calculation for a deposition rate at a specific level-set node. The proposed algorithm makes it possible to reduce the number of [...]

Physical Modeling of MEMS Cantilever Beams and the Measurement of Stiction Force

Lam T., Darling R.B., University of Washington, US

A finite element model is combined with experimental data to extract the stiction force in MEMS cantilever beams. The model predicts cantilever behaviors both before and after snap-down has occurred. Experimental measurements of cantilevers have [...]

Direct Write Technology as a Tool to Rapidly Prototype Patterns of Biological and Electronic Systems

Ringeisen B.R., Chrisey D.B., Piqué A., Krizman D., Brooks M., Spargo B., Naval Research Laboratory, US

The full potential of modeling and simulations is only realized when it is based on experimental results under varied conditions and systems. A single tool to rapidly prototype electronic and biological circuits would enhance the [...]

Mechanical Property Measurement of Thin-film Gold Using Thermally Actuated Bimetallic Cantilever Beams

Pamula V.K., Jog A., Fair R.B., Duke University, US

We describe a method for estimating the Young's modulus of thin-film gold deposited on the poly2 layer in the MUMPS process is described. An optical detection system employing position sensitive detectors (PSD) is built to [...]

Parameter Extraction for Surface Micromachining Using Eelectrical Characterization of Sensors

Maute M., Kimmerle S., Franz J., Hauer J., Schubert D., Krauss H.-R., Kern D.P., Robert Bosch GmbH, DE

This paper presents a novel methodology for the extraction of process dependent geometrical parameters of surface micromachined sensors. This approach is based on the electrical measurement of static capacitance-voltage characteristics of the sensor element on [...]

3-D Computational Modeling of RF MEMS Switches

Espinosa H.D., Fischer M., Zhu Y., Lee S., Northwestern University, US

Young's modulus and residual stress state of freestanding thin membranes are characterized in this work by means of wafer level experimental techniques. RF MEMS Switches manufactured by Raytheon Systems Co. are investigated using a new [...]