Papers – Page 6 – TechConnect Briefs

Numerical Fracture Analysis of MEMS Devices

Tayebi A.K., Tayebi N., Tayebi A.K., Tayebi N., Case Western Reserve University, US

Non-conventional finite element analysis (FEA) based on linear elastic fracture mechanics (LEFM) is applied to fractured MEMS specimens with notches. The objective of this paper is to test the applicability of LEFM at mesoscale and [...]

Strength Prediction for MEMS Components Transferring Large Loads

Chu L-H., Chen Q., Carman G.P., University of California, Los Angeles, US

In this paper the authors present a new strength criteria combined with a finite element analysis to predict the strength of MEMS fabricated microridges. The single crystal silicon microridges can be manufactured by various processes [...]

Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules

Ramminger S., Mitic G., Türkes P., Wachutka G., Siemens AG, DE

High voltage and high current power modules are key components for traction applications. In the future, railway locomotives, tramways and elevators will be equipped with Insulated Gate Bipolar Transistor (IGBT) modules. In this field of [...]

A Simple VLSI Spherical Particle-Induced Yield Predictor

Nakamae K., Ohmori H., Fujioka H., Osaka University, JP

A simple VLSI particle-induced yield predictor has been developed that allows us to predict the entire yield of VLSI and also to analyze the bottleneck processing steps and faults. Particles with spherical shape are generated [...]

Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale Copper

Heino P., Ristolainen E., Tampere University of Technology, FI

We study the effects of thermally induced shear strain and stress in several nanoscale copper systems consisting of about 200k atoms with the effective-medium theory and molecular dynamics method. Both edge and screw dislocations are [...]

Modeling Nucleation and Growth of Voids During Electromigration

Richards D., Adams J.B., Borucki L.J., Arizona State University, US

We calculate the formation energy of small voids in Al and Cu, both at the bulk and at grain boundaries, using the Embedded Atom Method. Then, we use those results as input to a Kinetic [...]

Monte Carlo Modeling of Thin Film Deposition: Influence of Grain Boundaries on the Porosity of Barrier Layer Films

Dalla Torre J., Gilmer G.H., Windt D.L., Baumann F.H., Huang H., Díaz de la Rubia T., Djafari-Rouhani M., Bell Labs, Lucent Technologies, US

We present Monte Carlo simulations of metallic thin films grown by sputter deposition from an infinite target. The Monte Carlo model includes ballistic deposition from the target, surface diffusion, and polycrystalline film growth. We study [...]

3D Modeling of Metallic Grain Growth

George D., Carlson N., Gammel J.T., Kuprat A., Los Alamos National Laboratory, US

This paper will describe simulating metallic grain growth using our Gradient Weighted Moving Finite Elements code, GRAIN3D. We also describe the set of mesh topology change operations developed to respond to changes in the physical [...]

Computational Modeling with a New Lattice-Based Continuum Formulation for the Coupled Thermodynamic and Mechanical Equilibrium of Polycrystalline Solids

Bassman L., Garikipati K., Deal M., Stanford University, US

A new formulation and computational framework is presented for modeling coupled self-diffusion and mechanics in polycrystalline materials. The continuum formulation includes constitutive models derived from lattice-level thermodynamic and mechanical considerations. From a complete statement of [...]

Modeling Facet Growth of Cu Thin Films

Wang Z., Li Y., Adams J.B., Arizona State University, US

We present a Kinetic Lattice Monte Carlo (KLMC) model, which describes deposition, surface self-diffusion, nucleation, and film growth on fcc metal substrates. The activation energies for diffusion are calculated using embedded-atom method (EAM). Using this [...]