Nanoelectronics – Page 21 – TechConnect Briefs

Compliant interconnect technology for power modules in automotive applications

Nenzi P., University of Rome “La Sapienza”, IT

This work will present a new bond-less, economic viable, alternative to wire bonding technology for power dice interconnection in automotive applications. In the presented technology bond wires are replaced by compliant contacts embedded in a [...]

Effects of Ag and Pd Addition on Mechanical Property and Ion-migration Tolerance in Low Temperature Sintering Bonding Using Ag2O Paste

Hirose A., Itou T., Ogura T., Osaka University, JP

We have proposed a new bonding process using Ag2O paste composed of Ag2O particles mixed with reduction agent of triethylene glycol (TEG). Ag nanoparticles formed at around 130℃ to 160℃ through the reduction process. Such [...]

Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging

Gao F., Gu Z., Shina S., Morose G., Eliason P., Farrell R., University of Massachusetts-Lowell, US

The current demand for high-performance interconnects in advanced packaging is resulting in dramatic scaling down of the electronics packaging feature size from microscale to nanoscale. Novel and/or enhanced interconnection and packaging techniques have to be [...]

Novel Nanofiber Anisotropic Conductive Films (ACFs) with coupled conductive particles for Ultra Fine Pitch Electronic Packaging Applications

Suk K-L, Paik K.W., KAIST, KR

In this study, a novel concept of nanofiber ACFs with conductive particles coupled in a nanofiber structure is suggested for ultra fine pitch applications. It was clearly demonstrated that novel nanofiber ACFs effectively suppressed the [...]

Advanced Packaging and Compound Semiconductors

Copper Displacement Deposition on Nanostructured Porous Silicon

Bandarenka H., Redko S., Nenzi P., Balucani M., Belarusian State University of Informatics and Radioelectronics, BY

In the present work we have demonstrated nanosized structures fabrication by the copper displacement deposition on electrochemically etched porous silicon. Peculiarity of such method is the convergence of copper reduction with porous silicon dissolution. Principal [...]

Embossed and Intaglio Nano-Patterning using Nanopipette based on the QTF-AFM System

An S.M., Lee K.Y., Jhe W.H., Seoul National University, KR

We demonstrated embossed and intaglio nano-patterning using Nanopipette based on the QTF-AFM (Quartz Tunning Fork-Atomic Force Microscopy) system. Used materials in the patterning system were nanoparticles solution and acetone for delivery solution mica and flat [...]

Chip Scale Focussed Electron Beam Induced Etching of a Silicon Nitride Membrane with Unique Beam Writing Strategies

Burcham K.E., Fridmann J., Klingfus J., Sanabia J.E., Raith USA, US

We present our work using FEBIP processes to etch nanopores within a silicon nitride membrane. We utilize an electron beam rastered in concentric rings rather than a position fixed beam to reduce charging of the [...]

A new route to control the enhancement of structural and anisotropy ordering in two-dimensional particle arrays

Regtmeier A., Wittbracht F., Dück I., Rempel T., Weddemann A., Hütten A., Bielefeld University, DE

For the realization of data storage devices two fundamental requirements are necessary to guarantee good functionality: a) particles need to be arranged within a sizeable, two-dimensional monolayer of high spatial ordering and b) magnetic states [...]

Poly(caprolactone)–Pluronic– poly(caprolactone) amphiphilic copolymer nanoparticles for controlled 5-Fluorouracil delivery

Mohamed M.M., Faculty of Allied Medical Science, Pharos University in Alexandria, EG

5-Fluorouracil (5-FU), a pyrimidine analogue that interferes with thymidylate synthesis, has a broad spectrum of activity against solid tumors. However, 5-FU has limitations that include a short biological half-life, incomplete and non-uniform oral absorption, toxic [...]