In this study, a novel concept of nanofiber ACFs with conductive particles coupled in a nanofiber structure is suggested for ultra fine pitch applications. It was clearly demonstrated that novel nanofiber ACFs effectively suppressed the [...]
, Farrell, R.
, Gao, F.
, Gu, Z.
, Morose, G.
, Shina, S.
, University of Massachusetts-Lowell, US
The current demand for high-performance interconnects in advanced packaging is resulting in dramatic scaling down of the electronics packaging feature size from microscale to nanoscale. Novel and/or enhanced interconnection and packaging techniques have to be [...]
We have proposed a new bonding process using Ag2O paste composed of Ag2O particles mixed with reduction agent of triethylene glycol (TEG). Ag nanoparticles formed at around 130℃ to 160℃ through the reduction process. Such [...]
This work will present a new bond-less, economic viable, alternative to wire bonding technology for power dice interconnection in automotive applications. In the presented technology bond wires are replaced by compliant contacts embedded in a [...]
A new technology for the integration of 3D antenna structure in packages will be presented. The integration of antennas on top of silicon chips or, in the same package is viable for frequencies above 40GHz [...]
The interest in organic thin film transistor (OTFT) is rising rapidly in recent years because of its potentially low cost, flexibility, light weight and simple fabrication process. This study aims to investigate the potential of [...]
In order to make all-printed thin-film transistors, the key issue such as the interfacing effect between printed electrodes and printed semiconductive channel layer has to be solved.In this study, thin film transistors were fabricated by [...]
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 13, 2011
Industry sector: Sensors, MEMS, Electronics
Topicss: Advanced Manufacturing, Nanoelectronics