u-Helix 3D-antenna technology
A new technology for the integration of 3D antenna structure in packages will be presented. The integration of antennas on top of silicon chips or, in the same package is viable for frequencies above 40GHz [...]
Authors: Nenzi P.
Compliant interconnect technology for power modules in automotive applications
This work will present a new bond-less, economic viable, alternative to wire bonding technology for power dice interconnection in automotive applications. In the presented technology bond wires are replaced by compliant contacts embedded in a [...]
Copper Displacement Deposition on Nanostructured Porous Silicon
Bandarenka H., Redko S., Nenzi P., Balucani M., Belarusian State University of Informatics and Radioelectronics, BY
In the present work we have demonstrated nanosized structures fabrication by the copper displacement deposition on electrochemically etched porous silicon. Peculiarity of such method is the convergence of copper reduction with porous silicon dissolution. Principal [...]