Keywords: ACF, assembly, fine pitch packaging, nanofiber
In this study, a novel concept of nanofiber ACFs with conductive particles coupled in a nanofiber structure is suggested for ultra fine pitch applications. It was clearly demonstrated that novel nanofiber ACFs effectively suppressed the free movement of conductive particles during ACF bonding process resulting in (1) good bump contact resistance by guaranteeing certain amount of conductive particles captured at a bump and (2) complete elimination of the electrical shortage problem of COF(Chip On Flex) packages at less than 20 micron pitch. Furthermore, the novel nanofiber ACFs represented an excellent example of how nanotechnologies can solve the problems of current electronic packaging technologies.
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 13, 2011
Pages: 418 - 421
Industry sector: Sensors, MEMS, Electronics
Topics: Advanced Manufacturing, Nanoelectronics
ISBN: 978-1-4398-7139-3