Nenzi P.
University of Rome “La Sapienza”, IT
Keywords: automotive, ompliant interconnect, power modules, wire bonding
This work will present a new bond-less, economic viable, alternative to wire bonding technology for power dice interconnection in automotive applications. In the presented technology bond wires are replaced by compliant contacts embedded in a polymer core that are pressed with a prescribed force over the power dice to establish and maintain stable low-resistance contact. The other end of the wire is bonded to a multi-layer substrate that acts as redistribution layer between dice and as a substrate for control electronics. The resulting power module integrates power and control electronics in a single, compact package with lower wire parasitics than wire-bonding.
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 13, 2011
Pages: 430 - 433
Industry sector: Sensors, MEMS, Electronics
Topics: Advanced Manufacturing, Nanoelectronics
ISBN: 978-1-4398-7139-3