Modeling & Simulation of Microsystems – Page 36

3-D Computational Modeling of RF MEMS Switches

Espinosa H.D., Fischer M., Zhu Y., Lee S., Northwestern University, US

Young's modulus and residual stress state of freestanding thin membranes are characterized in this work by means of wafer level experimental techniques. RF MEMS Switches manufactured by Raytheon Systems Co. are investigated using a new [...]

Stress Measurement in MEMS Devices

Starman Jr. L., Busbee J., Reber J., Lott J., Cowan W., Vandelli N., Wright-Patterson AFB, US

Due to the unique structure and small scale of Micro-Electro-Mechanical Systems (MEMS), residual stresses during the deposition processes can have a profound affect on the functionality of the MEMS structures. Typically, material properties of thin [...]

Three-Dimensional Effects Obtained from Capacitance Analysis of an SRAM Cell

Takemura Y., Osada K., Yagyu M., Yamaguchi K., Ushio J., Maruizumi T., Hitachi Ltd., JP

Employing Green's function method, we analyzed the 3D capacitance for the hole interconnect structure in an SRAM cell. We found novel 3D effects as follows; (1) via connection increases the capacitance of parallel lines, (2) [...]

Predictive and Calibrated Simulation of Doping Profiles: Low Energy As, B and BF2 Ion Implantation

Scheiblin P., Roger F., Poncet D., Laviron C., Holliger P., Laugier F., Guichard E., Caire J.P., LETI, FR

In this work, we propose calibrated models for predictive simulation of low energy Arsenic, Boron and BF2 ion implantation in the suitable range for sub-100nm CMOS technology. The International Technology Roadmap for Semiconductors (ed. 1999) [...]

Characterizaton, Parameter Extraction, Calibration

A Method for Determining the Dependence of Integrated Circuit Performance on Silicon Process, Device and Circuit Parameters

Sipahi L.B., Myers B.A., Sanders T.J., Intersil Corporation, US

The goal of this project is to develop a structured methodology for achieving a design of a block of circuit in an IC which is more compliant to the specification using a multiple simulation approach. [...]

Statistical Optimal Design of Microelectromechanical Systems (MEMS)

Ren H., Jog A., Fair R.B., Duke University, US

A three-step technique for MEMS quality optimization is demonstrated. It exploits the relative merits of its constituent optimization components. Analog Devices' ADXL50 accelerometer was the test device with microstructure dimen-sions serving as design parameters. Manufacturing [...]

Topic: Modeling & Simulation of Microsystems