TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeTopicsMEMS & NEMS Devices, Modeling & Applications

Topic: MEMS & NEMS Devices, Modeling & Applications

Three-Dimensional CFD-Simulation of a Thermal Bubble Jet Printhead

Lindemann T., Sassano D., Bellone A., Zengerle R., Koltay P., University of Freiburg, DE
This paper reports on a three-dimensional simulation of a commercial, thermally actuated bubble jet printhead using an appropriate pressure boundary condition for the bubble nucleation and expansion. The ink jet system has been used as [...]

Electromechanical Buckling of a Pre-Stressed Layer Bonded to an Elastic Foundation

Abu-Salih S., Elata D., Technion – Israel Institute of Technology, IL
The electromechanical buckling of a pre-stressed layer bonded to an elastic foundation is analyzed. A new analytic solution of the mechanical post-buckling is presented. In addition, it is shown that electrostatic forces can precipitately instigate [...]

Contact Force Models, including Electric Contact Deformation, for Electrostatically Actuated, Cantilever-Style, RF MEMS Switches

Coutu_Jr. R.A., Kladitis P.E., Air Force Institute of Technology, US
Electrostatically actuated, cantilever-style, metal contact, radio frequency (RF), microelectromechanical systems (MEMS) switches depend on having adequate contact force to achieve desired, low contact resistance. In this study, contact force equations that account for beam tip [...]

Free Surface Flow and Acousto-Elastic Interaction in Piezo Inkjet

Wijshoff H., Océ Technologies B.V., NL
Modeling plays an essential role in our research on new inkjet technologies. Structural modeling with Ansys includes piezo-electricity. Acoustic modeling in Ansys and Matlab involves fluid-structure interaction. CFD modeling with Flow3D includes wall-flexibility and free [...]

MEMS Modeling

Sub-Threshold Electron Mobility in SOI-MESFETs

Khan T., Vasileska D., Thornton T.J., Arizona State University, US
Micropower circuits use subthreshold MOSFETs that consume minimal power resulting from the combination of ultra-low drain currents (10-11 < Id < 10-5 A/µm) and small drain voltages required for saturation (Vd sat ~150-200mV). Unfortunately, sub-threshold [...]

Atomistic Process and Simulation in the Regime of sub-50nm Gate Length

Kwon O., Kim K., Seo J., Won T., Inha University, KR
In this paper, we report an atomistic simulation approach for sub-50nm gate length FETs. The proposed atomistic approach consists of the coupling the molecular dynamics (MD) simulations of the collision cascades for ion implantation process [...]

Ab Initio Simulation on Mechanical and Electronic Properties of Nanostructures under Deformation

Umeno Y., Kitamura T., Kyoto University, JP
Nanostructures have been attracting attention because of their prominent properties, and their applications for novel devices with advanced functions have been attemted. Large stress and strain occur in local regions in materials with nanostructures owing [...]

Principles of Metallic Field Effect Transistor (METFET)

Rotkin S.V., Hess K., University of Illinois at Urbana-Champaign, Beckman Institute for Advanced Science and Technology, US
Field effect transistors in current use are semiconductor devices. The scaling trend to nanometer dimensions calls for ever higher doping and channel conductance of these devices. Ultimately one desires a conductance close to that of [...]

Hierarchical Simulation Approaches for the Design of Ultra-Fast Amplifier Circuits

Desai J., Aboud S., Chiney P., Osuch P., Branlard J., Goodnick S., Saraniti M., IIT/Rush University, US
In this work, the design and development of ultra-fast amplifier circuits is investigated using a combination of simulation tools, including PSPICE. A fully depleted SOI transistor is designed based on state-of-the-art fabricated devices. To calibrate [...]

Posts pagination

« 1 … 46 47 48 … 74 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.