Electromechanical Buckling of a Pre-Stressed Layer Bonded to an Elastic Foundation

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The electromechanical buckling of a pre-stressed layer bonded to an elastic foundation is analyzed. A new analytic solution of the mechanical post-buckling is presented. In addition, it is shown that electrostatic forces can precipitately instigate buckling even when the pre-stress is lower than the critical value that allows mechanical buckling.

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Journal: TechConnect Briefs
Volume: 2, Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 2
Published: March 7, 2004
Pages: 223 - 226
Industry sector: Sensors, MEMS, Electronics
Topics: MEMS & NEMS Devices, Modeling & Applications
ISBN: 0-9728422-8-4