MEMS & NEMS Devices, Modeling & Applications – Page 30

Smart Pressure Sensor on SOI optimized by Finite Element Analysis for Heatspreader Integration

Bercu B., Montès L., Morfouli P., INPG-MINATEC, FR

Finite element analysis is used to maximize the response of the piezoresistive pressure sensor into an integrated heatspreader, designed for high-power electronic device cooling. This study shows the possibility of obtaining small area piezoresistive pressure [...]

Multiphysics Modeling and Simulation for a MEMS Thermal-Mechanical Switch

Wang W., Popuri R., Onishi S., Bumgarner J., Langebrake L., University of South Florida, US

This paper presents the results of finite element analysis (FEA) modeling and simulation including thermal-electric-structural multiphysics contact phenomenon for a MEMS thermal-mechanical DC switch. The parametric model can be used for design optimizations.The switch consists [...]

Manipulation of Capillary force by Electrowetting for Micromanipulation

Chandra S., Batur C., University of Akron, US

Microassembly is the future of MEMS and NEMS technology. But greatest barrier to the idea of micro scale assembly is micromanipulation. The steps in micromanipulation are pickup, moving and releasing and the most difficult part [...]

Strong and Weak Inversion Mode of MOS in the Design of Direction Sensitivity Matrix

Husak M., Boura A., Jakovenko J., Czech Technical University in Prague, CZ

In the article there is presented a new arrangement of a temperature sensor system for air velocity and direction measurement. The system utilizes temperature dependence of the current through the channel of MOS structure. The [...]

Parameterizable Library Components for SAW Devices

Wilson W.C., Atkinson G.M., NASA Langley Research Center, US

The lack of integrated design tools for SAW devices has led us to develop tools that in the future will enable integrated design, modeling, simulation, analysis and automatic layout generation of Surface Acoustic Wave (SAW) [...]

Microcantilever Sensor via Second Order Sliding Mode Control

English J., Shtessel Y., Yegnaraman M., George M., University of Alabama in Huntsville, US

Improved sensor measurements using second-order sliding mode control of a mass sensor based on a microcantilever is considered. The microcantilever-based mass sensor detects mass loading via deflections in nanometer scale. The polymer-coated cantilever is exposed [...]

Adaptive Control for Reducing the Effect of Damping on the Output Signal of Microgyroscopes

Khalilyulin R., Hauck T., Wachutka G., Münich University of Technology, DE

A mixed-level modeling methodology is employed to set up a full system simulation model for microgyroscopes together with the control circuitry in order to investigate the performance of novel adaptive closed-loop control strategies, which allow [...]

Simulations of the Anchor Losses in MEM Disk Resonators

Paci D., Stoffels S., Tilmans H.A.C., IMEC, BE

MEM (Micro Electro Mechanical) resonators have been proposed as fundamental components in RF transmission systems; especially bulk mode resonators are very attractive devices because of their small size and their high resonance frequencies combined with [...]

Analytic Damping Model for a Square Perforation Cell

Veijola T., Helsinki University of Technology, FI

A compact model for a square perforation cell is derived. It is generated both analytically and with 3D FEM simulations of the structure. The model consists of six flow resistances, whose values are simple functions [...]

MEMS Process Characterization with an on-Chip Device

Garmire D., Choo H., Muller R.S., Govindjee S., Demmel J., UC-Berkeley, US

We have developed a CMOS-compatible, compact device and a simple procedure for measuring three important fabrication characteristics of planar-processed microelectromechanical (MEMS) structures: in-plane over- or under-cut, Young’s Modulus, and comb-drive forces in a MEMS process. [...]