Compact Modeling

Detailed Comparison of the SP2001, EKV, and BSIM3 Models

Bendix P., LSI Logic, US

Practical comparisons are made of three available or soon to be available compact MOS models----SP2001 (surface potential 2001), EKV, and BSIM3. They are compared both in their DC and AC quality of fits to measured [...]

Challenges of Modeling VLSI Interconnects in the DSM Era

Arora N.D., Simplex Solutions, US

As VLSI technology shrinks to deep sub-micron (DSM) geometries (below 0.18mm), the parasitic due to interconnects are becoming a limiting factor in determining circuit performance. An accurate modeling of interconnect parasitic resistance (R), capacitance (C) [...]

Macromodeling Temperature-Dependent Curl in CMOS Micromachined Beams

Iyer S., Lakdawala H., Fedder G.K., Mukherjee T., Carnegie Mellon University, US

Temperature sensitive curling is commonly observed in MEMS structures fabricated using a standard CMOS pro-cess. In this paper, a macromodel for vertical and lateral curling effects is derived by extending thermal multimorph theory for cantilever [...]

Boundary Independent Exact Thermal Model for Electronic Systems

Gerstenmaier Y.C., Pape H., Wachutka G., Siemens AG, Corporate Technology, DE

A compact thermal model is presented, which describes the hot spot (junction) temperatures and contact heat flows of electronic packages or systems in the stationary state. The model is exact provided that the underlying heat [...]

A Design Approach for Robustness Improvement of Rate Gyroscopes

Acar C., Shkel A., University of California Irvine, US

This paper reports a design concept for robustness improvement of micromachined gyroscopes. The novelty of the approach is in expanding the design space of the device by increasing the degrees-of-freedom (DOF) of the system. The [...]

Compact Model for the Squeezed-Film Damping Including the Open Border Effects

Veijola T., Ruokonen K., Tittonen I., Helsinki University of Technology, FI

A numerical model for the squeezed-film damping between moving rigid, rectangular surfaces is presented. The emphasis is on the nontrivial boundary conditions for the flow, accounting for the finite acoustic impedance of the surrounding gas [...]

Scalable Macromodels for Microelectromechanical Systems

Srinivasan V., Jog A., Fair R.B., Duke University, US

A fully automatic macromodeling methodology to generate scalable reduced-order models for microelectromechanical systems is presented in this paper. Krylov subspace methods are used to generate reduced-order models from detailed higher-order models of the device under [...]

Table-Based Numerical Macromodeling for MEMS Devices

Wu J., Carley L.R., Carnegie Mellon University, US

In this paper, we present a table-based numerical macromodeling method in which a MEMS device is modeled by a set of numerical ordinary differential equations and model functions are represented by look-up tables of numerical [...]

Full Wave Electromagnetic Analysis and Model Order Reduction for Complex Three Dimensional Structures

Balk I., He Y., IntelliSense Corporation, US

Progress in MEMS and packaging design has made significant changes in the requirements for modeling tools. In order to design a modern microdevice or interconnect system it is no longer sufficient to limit the analysis [...]