TechConnect Briefs
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeSectorsSensors, MEMS, Electronics

Sector: Sensors, MEMS, Electronics

Dynamic Modelling and Simulation of Microelectromechanical Devices with a Circuit Simulation Program

Veijola T., Kuisma H., Lahdenperä J., Helsinki University of Technology, FI
Simulation blocks of micromechanical sensors and actuators modelling their dynamic electromechanical and fluidic operation are presented. Due to the electrical equivalent circuit realization the sensor system simulations in the frequency and time domains are possible. [...]

Simulation of Electrothermal MOS Circuits Using Saber

Liu C.C., Carlen E.T., Wise K.D., Mastrangelo C.H., University of Michigan, US
In this paper we present a simple methodology for simulating small to medium sized circuits where electrical and thermal equations are solved simultaneously using Saber, a commercial, general purpose simulator. Dynamic electrothermal models have been [...]

Network-Type Modeling of Micromachined Sensor Systems

Lorenz G., Neul R., Robert Bosch GmbH, DE
This paper describes the development of networktype models for the simulation of micromechanical components such as spatial beams and masses. The models were coded in MASTÆ for the SABERÆ simulator and their accuracy was compared [...]

Simulation of Mixed-Signal Systems in Standard VHDL

Grätz H., Fischer W-J, Fraunhofer-Institute of Microelectronic Circuits and Systems, DE
Historically, the analogue and digital parts of a hardware design have been modelled and simulated in different environments and could not be combined in a single simulator. On the other hand, if a design contains [...]

Equivalent Circuits, Behavioral and Multilevel Simulation

Inductance Extraction by Means of the Monte Carlo Method

Leonhardt G., Hager C., Regli P., Fichtner W., ETH-EPFL, CH
This paper presents a novel inductance extraction procedure which is based on a Monte Carlo sampling technique. Partial inductances for static current distributions can be computed efficiently and with small memory requirements, thus enabling the [...]

Analysis and Characterization of Laterally Induced Electrostatic Repulsive Forces

Lee K.B., Cho Y-H, Korea Advanced Institute of Science and Technology, KR
We analyze and characterize the laterally induced electrostatic repulsive force generated by the in-plane asymmetry of electrostatic field. Basic concept of the electrostatic repulsive actuation is presented. Fundamental nature of the repulsive force has been [...]

Validation and Calibration of Electrothermal Device Models Using Infrared Laser Probing Techniques

Thalhammer R., Fürböck C., Seliger N., Gornik E., Wachutka G., Technical University of Münich, DE
As it has recently been demonstrated, the internal distribution of carrier concentration and temperature is accessible to accurate measurements by various infrared laser probing techniques. In this work we present an advanced method for the [...]

Methodology for Calibrating Process and Device Simulators by Extracting Model Parameters from Electrical Data

Ho H-M, Zu Y., Loiko K.V., Lim D.H.Y., Chartered Semiconductor Manufacturing Ltd., SG
This paper describes a physically based methodology for calibrating 2D semiconductor process and device simulators. The calibration begins with the determination of 1D and 2D doping profiles by means of extracting model parameters from electrical [...]

Rational RSM Models for Device Characteristics as Functions of Process Parameters

Granik Y., Moroz V., PDF Solutions, Inc., US
Conventional polynomial Response Surface Methodology (RSM) fails to provide oscillation-free analytical models for some device data with singularity like subthreshold slope vs threshold adjustment dose, poly gate length vs stepper defocus, etc. New type of [...]

Posts pagination

« 1 … 408 409 410 … 414 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.