TechConnect Briefs
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeSectorsAdvanced Materials & Manufacturing

Sector: Advanced Materials & Manufacturing

A Model for Enhanced Chemiluminescence Reactions in Microsystems

Berthier J., Joly P., Rivera F., Caillat P., CEA-LETI, FR
Detection of hybridized targets—like DNA strands—in microsystems for biotechnology is usually done by fluorescence. However, recent investigations have shown that chemiluminescence could be a more effective and sensitive tool for detection under the condition that [...]

A Systems Design Framework Based in Matlab That Integrates Sugar, Spice, Simulink, Fea Comsol, and GDS-II Layout

Marepalli P., Clark J.V., Purdue University, US
We present a systems design framework called iSUGAR that integrates SUGAR, SPICE, SIMULINK, FEA COMSOL, and GDS-II layout. SUGAR is known for its ease and speed of complex MEMS configuration and parameterization; SPICE is known [...]

Neuromorphic Logic Networks and Robust Stochastic Computing Under Large Perturbations and Uncertanties

Lyshevski S.E., Rochester Institute of Technology, US
This paper contributes to robust fault-tolerant neuromorphic computing for expected nano-centric processing hardware. We develop: (a) A library of neuromorphic networks for elementary logic function in order to enable the design of an arbitrary complexity [...]

Compact Modeling of Signal Transients and Integrity Analysis for Dispersionless Interconnect

Zhao W., PKU HKUST Shenzhen Institution of IER., CN
In this paper, a compact model for transient response of the dispersionless interconnects is rigorously derived with resistive, inductive and capacitive load terminations. The proposed compact models are verified by the HSPICE simulation result to [...]

A Drift-Diffusion Model of Pinned Photodiode Enabling Opto-Electronic Circuit Simulation

Mei S., Peking University Shenzhen Graduate School, CN
A drift-diffusion analytical model with bounded boundary conditions for CMOS Image Sensor (CIS) in a vertical pinned photodiode (PPD) is presented in this paper. According to the comparison with the numerical simulation and measured data, [...]

The role of Electromechanical coupling in AlGaN/AlN/GaN HEMTs

Padmanabhan B., Vasileska D., Goodnick S.M., Arizona State University, US
we present simulation results for GaN HEMTs in which the structure has additional AlN spacer layer thus completely modifying the electromechanical coupling approach.

High-Fidelity Modeling of Single Molecule Quantum Electronic Devices

Lyshevski S.E., Rochester Institute of Technology, US
Departing from two-terminal molecular electronic devices, this paper examines multi-terminal MEdevices. These devices are envisioned to be utilized in emerging molecular gates (Mgates) and neuronal hypercells for expected molecular integrated circuits. High-fidelity modeling and heterogeneous [...]

An Efficient Iterative Grid Selection Strategy for Time-Mapped Harmonic Balance Method

Xu Z., Peking University, CN
In this paper, a new iterative grid selection strategy for the Time-Mapped Harmonic Balance (TMHB) method is presented. This strategy is referred to the adaptive grid methods, which tracks the rapid transitions and constructs a [...]

Nonparabolicity Effects of the Ultra-thin Body Double-gate MOSFETs

Lou H., Peking University, CN
In this paper, the band-structure of ultra-thin body (UTB) double-gate (DG) MOSFETs is calculated by empirical tight-binding model, and the the nonparabolicity effects are included in the model by the modified Schrödinger equation with the [...]

Simplifying the Designing of a MEMS-based Nanoscale Material Testing Device

Bansal R., Clark J.V., Purdue University, US
Microelectromechanical-systems (MEMS) are increasingly used for accurate mechanical characterization of nanostructures. However, the performance of such systems highly depends on their structural design. Optimizing the performance of the device using distributed analysis is computationally expensive, [...]

Posts pagination

« 1 … 266 267 268 … 656 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.