Papers – Page 750 – TechConnect Briefs

Theory and Modeling Techniques used in PSP Model

Gildenblat G., Li X., Wang H., Wu W., Jha A., van Langevelde R., Scholten A.J., Smit G.D.J., Klaassen D.B.M., Pennsylvania State University, US

This paper describes theoretical foundation and details of the new compact modeling techniques used in the advanced surface-potential-based compact MOSFET model PSP, jointly developed by the Pennsylvania State University and Philips Research. Specific topics include [...]

Symbolic charge-based MOSFET model

Galup-Montoro C., Schneider M.C., Federal University of Santa Catarina, BR

The new generation of compact MOSFET models provides accurate current, charge, capacitance and noise characteristics as numerical outputs of a rather complicated set of internal equations specific to each model. Clearly, numerical circuit simulation is [...]

Application of a Design Methodology Using a 2D Micro Scanner

Anac O., Basdogan I., Koc university, TR

Micro Electro Mechanical Systems (MEMS) are the new and emerging technology of the future and have many applications on different disciplines like biomedical, imaging technology, biology etc. Characterization of motion and vibrations of such systems [...]

Modelling of Torsional Micromirrors with Springs made of Multiple Rotational Serpentine Elements

You J., Packirisamy M., Stiharu I., Concordia University, CA

In general, this paper presents the deduced analytical model and numerical simulation of electrostatically actuated torsional micromirrors with two symmetrical side springs of multiple rotational serpentine elements. Modelling of these kinds of micromirrors is carried [...]

Smart Pressure Sensor on SOI optimized by Finite Element Analysis for Heatspreader Integration

Bercu B., Montès L., Morfouli P., INPG-MINATEC, FR

Finite element analysis is used to maximize the response of the piezoresistive pressure sensor into an integrated heatspreader, designed for high-power electronic device cooling. This study shows the possibility of obtaining small area piezoresistive pressure [...]

Multiphysics Modeling and Simulation for a MEMS Thermal-Mechanical Switch

Wang W., Popuri R., Onishi S., Bumgarner J., Langebrake L., University of South Florida, US

This paper presents the results of finite element analysis (FEA) modeling and simulation including thermal-electric-structural multiphysics contact phenomenon for a MEMS thermal-mechanical DC switch. The parametric model can be used for design optimizations.The switch consists [...]

Manipulation of Capillary force by Electrowetting for Micromanipulation

Chandra S., Batur C., University of Akron, US

Microassembly is the future of MEMS and NEMS technology. But greatest barrier to the idea of micro scale assembly is micromanipulation. The steps in micromanipulation are pickup, moving and releasing and the most difficult part [...]

Strong and Weak Inversion Mode of MOS in the Design of Direction Sensitivity Matrix

Husak M., Boura A., Jakovenko J., Czech Technical University in Prague, CZ

In the article there is presented a new arrangement of a temperature sensor system for air velocity and direction measurement. The system utilizes temperature dependence of the current through the channel of MOS structure. The [...]

Parameterizable Library Components for SAW Devices

Wilson W.C., Atkinson G.M., NASA Langley Research Center, US

The lack of integrated design tools for SAW devices has led us to develop tools that in the future will enable integrated design, modeling, simulation, analysis and automatic layout generation of Surface Acoustic Wave (SAW) [...]

Microcantilever Sensor via Second Order Sliding Mode Control

English J., Shtessel Y., Yegnaraman M., George M., University of Alabama in Huntsville, US

Improved sensor measurements using second-order sliding mode control of a mass sensor based on a microcantilever is considered. The microcantilever-based mass sensor detects mass loading via deflections in nanometer scale. The polymer-coated cantilever is exposed [...]