SPICE – Page 3 – TechConnect Briefs

Standardization of Compact Device moding in High Level Description Language

Lemaitre L., McAndrew C., Grabinski W., Motorola, CH

This paper proposes a methodology based on hardware description languages (HDL) to efficiently develop compact device models. After an introduction to compact device modeling we describe Verilog-AMS, a popular HDL. Then we show how Verilog-AMS [...]

An Interactive Website as a Tool for CAD of Power Circuits

Swiercz B., Starzak L., Zubert M., Napieralski A., Technical University of Lodz, PL

The rapid development of microelectronics results in more complex semiconductor device structures and makes it necessary to use modern computer software. However, high prices and hardware requirements considerably limit the access to these CAD tools [...]

BJT Modeling with VBIC, Basics and V1.3 Updates

McAndrew C., Bettinger T., Lemaitre L., Tutt M., Motorola, US

This paper reviews the VBIC BJT model, and details updates in the version 1.3 release. VBICv1.3 includes explicit interaction with siulator global parameters gmin and pnjmaxi, explicit limiting of local temperature rise and exponential arguments [...]

A Framework for Generic Physics Based Double-Gate MOSFET Modeling

Chan M., Taur Y., Lin C.H., He J., Niknejad A., Hu C., Hong Kong University of Science & Technology, HK

This paper presents a framework to develop a generic and physical Double-Gate MOSFET model. Due to limited available physical data and existence of a large variety of device structures, flexibility to assemble model modules to [...]

Engineering BSIM for the Nano-Technology Era and Beyond

Chan M., Hu C., Hong Kong University of Science and Technology, HK

This paper presents the current status of the forth generation BSIM model and issues of modeling CMOS based devices with nanometer dimensions. Due to the divergence of device structures in sub-0.1 m gate length, it [...]

RESCUER – the New and Effective Tool for Automatic Models Reduction – Application for Electro-Thermal Problems

Napieralski A., Zubert M., Napieralska M., Technical University of Lódz Al, PL

This paper presents some methods of thermal model reduction and translation into hardware description languages or other ones. The very effective model reduction is achieved owing to the application of higher order approximation and joint [...]

Noise Modeling Methodology for Full-System Inertial Microsensor Codesign

Pottenger M.D., Kaiser W.J., University of California at Los Angeles, US

Methos for incorporation noise models into full-system inertial microsensor simulation are presented. Thermal motion of the proof mass and flicker noise in the interface circuit exhibit essential behaviore that must be included in sensor design. [...]

Keywords: SPICE