numerical simulation – Page 2 – TechConnect Briefs

A New Lateral Trench Sidewall Schottky (LTSS) Rectifier on SOI

Singh Y., Kumar M.J., Indian Institute of Technology, IN

In this paper, a new Schottky rectifier structure, called Lateral Trench Sidewall Schottky (LTSS) rectifier on SOI is presented. Based on two-dimensional simulations, we demonstrate that the proposed device is superior in performance as compared [...]

Numerical Simulation of Droplet Shapes on Rough Surfaces

Patankar N.A., Chen Y., Northwestern University, US

It has been demonstrated that surface roughness causes superhydrophobicity. Our objective is to develop a numerical tool and study the relationship between the roughness characteristics and the apparent contact angle and motion of liquid drops [...]

Direct Numerical Simulation of Moving Charged, Flexible Bodies with Thermal Fluctuations

Patankar N.A., Northwestern University, US

The interaction of sub-micron scale objects with fluids is an important problem encountered in miniaturized systems. Various physical phenomena should be modeled simultaneously for a fundamental investigation of these systems. Our objective is to develop [...]

Impact of Non-Stationary Transport Effects on Realistic 50nm MOS Technology

Munteanu D., Le Carval G., Guegan G., LETI, CEA/Grenoble, DMEL, FR

This paper highlights the impact of non-stationary transport on performances of deep submicron CMOS bulk technology. We present a quantitative analysis of technology influence on the needed level for carrier transport modeling (Drift-Diffusion versus Energy [...]

Numerical Simulation and Analytical Modeling of Strong-Inversion Gate Capacitance in Ultra-Short (30nm) MOSFETs

Sudhama C., Spulber O., McAndrew C., Thoma R., Motorola SPS, US

Bulk and novel MOSFET structures with gate-lengths in the 30nm regime are to become industry standards in ~2007. As devices are scaled down to these lengths, overlap- and fringe-capacitance between the gate and source/drain regions [...]

Numerical Simulation of Micro Assembly Techniques in MEMS Devices

Finch N., Keating D., He Y., IntelliSense Corporation, US

This paper presents research on numerical simulation of the micro-assembly of MEMS devices. Recent developments in MEMS devices ñ making use of multiple deposition layers, micro-fabricated hinges, and actuators ñ have enabled fabrication of MEMS [...]