CEA/LETI/MINATEC – Page 2 – TechConnect Briefs

Performance study of Ballistic and Quasi-Ballistic on Double-Gate MOSFETs 6T SRAM cell

Martinie S., Jaud M-A, Munteanu D., Thomas O., Le Carval G., Autran J-L, CEA/LETI/MINATEC, FR

The impact of ballistic/quasi-ballistic carrier transport on the switch of a CMOS inverter and on the noise margin of a 6T SRAM cell, both based on Double-Gate MOSFETs (DGMOS), is analysed using mixed-mode simulation. To [...]

Sacrificial membranes for serial valving in microsystems

Allain M., Berthier J., Basrour S., Pouteau P., CEA/LETI/MINATEC, FR

Valving is essential to microflow circuits in microsystem technology. Many different types of valves have already been designed. Membranes of sacrificial materials have been studied for one shot valving; however, the new design proposed here, [...]

Silicon die self-alignment on a wafer: stable and instable modes

Berthier J., Grossi F., Di Cioccio L., CEA/LETI/MINATEC, FR

To create advanced Microsystems by 3D integration, die-to-wafer assembly is required to obtain fast and reliable packaging. In order to overcome the main difficulties of current techniques, self-assembly methods are promising due to their serial [...]

MOSFET Compact Modeling Issues for Low Temperature (77 K – 200 K) Operation

Martin P., Cavelier M., Fascio R., Ghibaudo G., CEA/LETI/MINATEC, FR

Advanced compact models are evaluated for simulation of mixed analog-digital circuits working at low temperature (77 to 200 K). This evaluation is performed on a dual gate oxide CMOS technology with 0.18 µm / 1.8 [...]

Analytical Modelling and Performance Analysis of Double-Gate MOSFET-based Circuit Including Ballistic/quasi-ballistic Effects

Martinie S., CEA/LETI/MINATEC, FR

As the MOSFET continues to shrink rapidly, emerging physical phenomena, such as ballistic transport, have to be considered in the modelling and simulation of ultra-scaled devices. Future Double-Gate MOSFETs, designed with channel lengths in the [...]

Mechanical characterization of electrostatic MEMS switches

Souchon F., Koszewski A., Levy D., Charvet PL., CEA/LETI/MINATEC, FR

The paper presents a methodology with nanoindentation experiments to characterize the mechanical properties of MEMS switches. After that, simple analytical models for mechanical and electrostatic aspects are used to validate these mechanical characterizations. At the [...]