US – Page 471 – TechConnect Briefs

High-Fidelity and Behavioral Simulation of Air Damping in MEMS

Turowski M., Chen Z., Prezekwas A., CFD Research Corporation, US

The paper presents simulations of air damping in MEMS, including squeeze-film and viscous dissipation, using different level models: 3D numerical solution of Navier-Stokes equations (using CFD-ACE from CFDRC), and circuit/behavioral model (in SPICE and Saber/MAST [...]

Coupled Package-Device Modeling for MEMS

Bart S.F., Zhang S., Rabinovich V.L., Cunningham S., Microcosm Technologies, Inc., US

Microelectromechanical Systems (MEMS), by their nature as sensors and actuators, require application specific packaging. The package is the near environment of the MEMS device and hence has a direct effect on its thermal behavior, on [...]

Visual Modeling and Design of Microelectromechanical System (MEMS) Transducers

Dewey A., Icoz E., Duke Univeristy, US

Microelectromechanical Systems (MEMS) integrates miniaturized mechanical structures with electronics to extend the benefits of planar integrated circuit technology to a broader class of systems. To realize the potential and growth of MEMS, new modeling, analysis, [...]

Partial-Element Equivalent-Circuit Model Simulation for Designing RF-Wireless Communication Products with Embedded Passive Components

Smith W.R., National Semiconductor Corporation, US

Rapidly increasing functionality and performance of RF/wireless communication products, along with mandated decreases in size, weight, and cost, have created a critical need to replace discrete, surface-mounted passive circuit components with embedded passives in substrate [...]

MEMS/MST Model Verification and Materials Parameter Extraction Using MEMSPEC-2000

Gutierrez A., Aceto S., Simkulet M., Patti D., Liendhard M., Krawczyk T., Lundgren A., InterScience, Inc, US

We describe the current status of the MEMSPEC-2000 MEMS/MST characterization system. This system has been designed to provide automated multi-domain measurements of a wide range of MEMS/MST devices. The system is capable of high resolution [...]

IMAP: Interferometry for Material Property Measurement in MEMS

Jensen B.D., de Boer M.P., Miller S.L., Sandia National Laboratory, US

An interferometric technique has been developed for non-destructive, high-confidence, in-si tu determination of material properties in MEMS. By using interferometry to measure the full deflection curves of beams pulled toward the substrate under electrostatic loads, [...]

Complete Characterization of Electrostatically-Actuated Beams Including Effects of Multiple Discontinuities and Buckling

Chan E.K., Garikipati K., Dutton R.W., Stanford University, US

The entire process of calibrating an electromechanical simulator ñ identifying relevant parameters, designing and measuring test structures, extracting parameters using detailed electromechanical simulations, and extrapolating the behavior of an actual device ñ is presented. The [...]

Parameter Extraction for a Microwave Micromachined Switch

Chen J., Coperich K.M., Kang S-M, Schutt-Aine J., University of Illinois at Urbana-Champaign, US

This paper details new parameter extraction methods for microwave micromachined switches. Speciffically new methods for extracting switch turn-on and turn-off transient behavior and switch electromagnetic behavior are discussed. The accuracy of these methods are verified [...]

Optimal Design of Computer Experiments for the Generation of Microsystem Macromodels Using IMSET and Non-Parametric Fitting

Crary S.B., Cousseau P., Armstrong D., Woodcock D.M., Dubochet O., Lerch P., Renaud Ph., University of Michigan, US

We present a new and unique software program, IMSET, capable of finding optimal designs for computer experiments. A finite-element simulation of a micro-machined flow sensor was used to illustrate macromodel generation and to compare the [...]

Modelling Calibration and Validation of Contributions to Stress in the STI Process Sequence

Garikipati K., Rao V.S., Hao M.Y., Ibok E., De Wolf I., Dutton R.W., Stanford University, US

The mathematics and mechanics of the Shallow Trench Isolation process are described. The diffusion reaction problem is posed in terms of fundamental mass balance laws. Finite strain kinematics is invoked to model the large expansion [...]