Coupled Package-Device Modeling for MEMS

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Microelectromechanical Systems (MEMS), by their nature as sensors and actuators, require application specific packaging. The package is the near environment of the MEMS device and hence has a direct effect on its thermal behavior, on mechanical effects, and on environmental compatibility and contamination. Therefore, understanding the influence of the packaging on MEMS device performance is critical to a successful coupled package-device co-design. Here, an automated package-device interaction simulator has been developed. The simulator uses separate Finite Element Method (FEM) models for both the package and the device analysis and ties the results together through parametric behavioral package models. This technique allows the generation of package model libraries and supports the co-design of application specific packaging and MEMS devices. Experimental verification of the technique is demonstrated by comparison of simulation results to measured package strain data.

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Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Published: April 19, 1999
Pages: 232 - 236
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9666135-4-6