, Kim, C.J.
, Kim, H.
, Kim, Y.K.
, Lee, D.J.
, Park, H-W.
, Park, Y.K.
, Korea Institute of Science and Technology, KR
RF-MEMS devices have the potential for providing an overarching circuit integration technology that can significantly reduce the size, weight and cost. In this research, as ultra thin silicon substrate which has thickness of 50um was [...]
In this paper, we have proposed a fabrication method of a RF-MEMS voltage tunable capacitor using Au-electroplating technique, which has one movable parallel plate with various structure of beams. We applied an electrostatic method and [...]
We report the simulation work done by using Sonnet EMÔ on high aspect ratio (1:4 and 1:8) 3D on-chip air-core solenoid inductors. Simulations on 2, 3, and 5-turn inductors with 200 and 400 mm high [...]
In the capacitive RF MEMS SW, it has been shown that every 5V of increased actuation voltage decreases the lifetime by an order of magnitude. In this paper, a novel method for automatically controlling the [...]
Therefore, this paper reports 3-dimensional Cu coaxial cylinder with a thick OPS(oxidized porous silicon) in low resistivity silicon for application of microwave and RF integrated circuit technology. A novel on-chip 3D coaxial cylinder was fabricated [...]
Micromechanical (or umechanical) communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible MEMS-based receiver front-end architectures are [...]
Journal: TechConnect Briefs
Volume: 2, Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 2
Published: February 23, 2003
Industry sector: Sensors, MEMS, Electronics
Topics: Modeling & Simulation of Microsystems